Wafer holding device in vacuum prewet cavity

Abstract

The invention provides a wafer holding device in a vacuum prewet cavity. The device comprises a cavity cover arranged at the top of the prewet cavity, a gasket is connected with the bottom of the cavity cover, and the cavity cover is obliquely arranged and forms an included relative to the horizontal plane. A plurality of hanging pillars are connected to the bottom of the gasket, the bottom of each hanging pillar is bent inwards, and all the hanging pillars form a wafer placing portion used for bearing wafers; Further, the bottoms of the hanging pillars are bent inwards to form bottom stairs, second stairs which are retracted relative to the bottom stairs are arranged on the bottom stairs, pillar bodies are arranged above the second stairs, and the bottom stairs of all the hanging pillars form the wafer placing portion together. Furthermore, the number of the hanging pillars is three, the hanging pillars are evenly connected to the same circumference of the gasket, the inner side walls of the bottom stairs of the hanging pillars are respectively in an arc shape and are on the same circumferential surface, the inner side walls of the second stairs of the hanging pillars are respectively in an arc shape, and the inner side walls of the pillar bodies of the hanging pillars are respectively in an arc shape. The wafer holding device in the vacuum prewet cavity is reasonable in design structure, and the wafers can be conveniently placed into or remove out of the device manually or automatically.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to a wafer holding device in a vacuum pre-wet chamber used in a vacuum pre-wet process. Background technique [0002] At present, the three-dimensional package through-silicon via (TSV, Through Silicon Via) technology is one of the core technologies in the research of three-dimensional integrated circuits. Copper is widely used in TSV interconnection due to its superior electrical and thermal conductivity. Copper electroplating is the main process of TSV filling and an important part of TSV technology. In the TSV electroplating copper filling process, the pre-wet process of TSV before electroplating is very important. If the pre-wet is not sufficient, there will be void defects inside the TSV after electroplating, which will seriously affect the reliability of TSV. [0003] The design of the holding device used in the vacuum pre-wet chamber is more important. If t...

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Problems solved by technology

In the TSV electroplating copper filling process, the pre-wet process of TSV before electroplating is very important. If the pre-wet is not sufficient, it will cause void defects inside the TSV after electroplating, which will seriously affect the reliability of TSV.

[0003] The design of the holding device used in the vacuum pre-wet chamber is more important. If the structure is unreasonable, it will be troublesome to insert and take out the wafer, which will affect the efficiency of the vacuum pre-wet process, or the wafer will easily slip from the holding device.

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