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Photoelectric component detection method and detection equipment implementing same

A detection method and technology of detection equipment, which are applied in the parts of electrical measuring instruments, measuring electricity, measuring devices, etc., to achieve accurate measurement values ​​and improve efficiency.

Inactive Publication Date: 2014-01-01
MICROELECTRONICS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as far as the applicant is aware, there is currently no detection method or detection equipment with high accuracy and / or fast detection speed for COB packaged LED modules.

Method used

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  • Photoelectric component detection method and detection equipment implementing same
  • Photoelectric component detection method and detection equipment implementing same
  • Photoelectric component detection method and detection equipment implementing same

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Embodiment Construction

[0037] The technical contents and features of the present invention will be described in detail below through the enumerated embodiments in conjunction with the accompanying drawings, wherein:

[0038] Figure 1 to Figure 12 , is a schematic diagram illustrating the corresponding relationship between each material carrier plate of the rotary indexing mechanism and each step of the detection method.

[0039] First of all, it must be noted that the optoelectronic components suitable for the detection method provided by the present invention can be (but not limited to) light emitting diode (light emitting diode, LED) package components or package modules, such as chip-on-board ( Chip on Board (COB) packaged LED modules. Secondly, throughout the specification, including the embodiments described below and claims for patent claims, when it is mentioned that one component is "connected" to another component, it means that the component is "directly" fixed to another c...

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Abstract

A photoelectric component detection method comprises the following steps: (a) a step of shifting a photoelectric component located in a material feeding position to a to-be-detected position corresponding to an opening of an integrating sphere; (b) a step of shifting the photoelectric component to the inside of the integrating sphere and enabling the photoelectric component to electrically contact a spot measurement device located inside the integrating sphere so as to carry out feature detection; (c) a step of shifting the detected photoelectric component out of the integrating sphere; and (d) a step of shifting the detected photoelectric component out of a material discharge position. Therefore, feature detection of the photoelectric component can be carried out inside the integrating sphere to obtain a more accurate measurement value. In addition, the invention discloses a piece of detection equipment implementing the detection method.

Description

technical field [0001] The invention relates to a detection method of optoelectronic components, in particular to a detection method of delivering the optoelectronic components to be detected into an integrating sphere for characteristic detection. The present invention also relates to a detection device for implementing the aforementioned detection method. Background technique [0002] Generally speaking, optoelectronic components such as light emitting diode (LED) single-chip packages or packaged modules are mostly subject to characteristic testing before leaving the factory. Components are graded. When the aforementioned optoelectronic components are tested, usually a fixture or a prober is used to electrically contact the optoelectronic components and supply detection power to make them emit light, so as to facilitate characteristic testing. Secondly, since more accurate test results can be obtained by using an integrating sphere for testing, it is an inevitable trend ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G01R1/02
Inventor 李俊明刘永钦胡平宇
Owner MICROELECTRONICS TECH INC
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