A kind of manufacturing method of printed circuit board and printed circuit board

Abstract

The invention discloses a method for manufacturing a printed circuit board and the printed circuit board. The method includes: setting a via hole between every two pads of the chip, the via hole connecting the printed circuit board PCB side where the chip is located with the other side of the PCB; on the other side of the PCB, A capacitor is arranged between every two via holes, the capacitor has two ends, each end has a pad, and the pads at both ends of the capacitor are centrally symmetrical to the central connection line of the two via holes, and the The edge distribution of the pads at both ends of the capacitor is tangent to the edge of the hole pads of the two via holes; the capacitor is connected to the chip through the via holes. A corresponding printed circuit board is also disclosed. The invention rationally utilizes the space gap of the through hole in the printed circuit board, can effectively increase the layout quantity of the filter capacitor, and improves the signal quality of the components in the printed circuit board.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a printed circuit board and the printed circuit board. Background technique [0002] Current Ball Grid Array (BGA) chips have higher and higher requirements for signal quality on Printed Circuit Board Assembly (PCBA), and capacitors are usually used to filter out interference signals to improve signal quality. [0003] For BGA chips with a pin spacing of 0.8mm to implement a capacitive filtering solution on the PCB, a method in the prior art is: use 0402 type capacitors for layout and use resin plug holes plus surface plating (Plating Over Filled Via, POFV) Processing technology, but the number of layout filter capacitors is small and the location is limited, which cannot meet the product's requirements for signal quality and high-density assembly. Moreover, the POFV processing technology has a great impact on product costs and cannot mee...

AI Technical Summary

Problems solved by technology

[0003] For BGA chips with a pin spacing of 0.8mm to implement a capacitive filtering solution on the PCB, a method in the prior art is: use 0402 type capacitors for layout and use resin plug holes plus surface plating (Plating Over Filled Via, POFV) Processing technology, but the number of layout filter capacitors is small and the location is limited, which cannot meet the product's requirements for signal quality and high-density assembly. Moreover, the POFV processing technology has a great impact on product costs and cannot meet the requirements of peer cost competition.

[0004] Another method is to use 0201 type capacitors for layout and POFV technology, which still has high PCB processing costs, and similar products do not have cost competitive advantages

[0005] Another way is, if figure 1 As shown, on the other side of the PCB side where the 0.8mm BGA chip is located, between the two via holes (VIA holes) 310, the 0201 capacitors are laid out at 45°, but this method needs to be adjusted for the pin signals of the BGA chip. Definition, it is difficult to realize on the circuit, and the number of 0201 capacitors in the layout is limited

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