A flameproof structure insulating heat pipe radiator
A heat pipe radiator and explosion-proof technology, which is applied in electric solid devices, semiconductor devices, cooling/ventilation/heating transformation, etc., can solve the limitation, limit the promotion of medium and high voltage electrical transmission devices, and cannot meet the insulation requirements of medium and high voltage electrical transmission devices. and other problems to achieve the effect of satisfying heat dissipation, insulation and explosion-proof
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Embodiment 1
[0024] Such as figure 1 As shown, the flameproof structure insulation heat pipe radiator of the present embodiment includes: a flameproof casing 2, and the flameproof casing 2 divides the space into the internal space of the flameproof casing and the external space of the flameproof casing; The internal space of the body is provided with an internal heat pipe insulation and heat dissipation device. The internal heat pipe insulation and heat dissipation device includes a heat conduction substrate 3, and a substrate hole is provided inside the heat conduction substrate 3, and the extension direction of the substrate hole is consistent with the extension direction of the heat conduction substrate; the internal heat pipe 1 , the internal heat pipe 1 has a heating end and a heat dissipation end, wherein the heating end of the internal heat pipe 1 is penetrated in the substrate hole, and a thermally conductive insulating material 4 is ringed between the hole wall of the substrate hol...
Embodiment 2
[0029] Such as figure 2 As shown, the second embodiment is basically the same as the first embodiment, except that the internal heat pipe 1 and the external heat pipe 8 are arranged separately, and both are in the shape of a horizontal "L". The heat dissipation end of the inner heat pipe 1 is fixed on the inner wall of the flameproof casing 2 , and the heated end of the outer heat pipe 8 is fixed on the outer wall of the flameproof casing 2 .
[0030] The heat dissipation process of the explosion-proof structure insulating heat pipe radiator of this embodiment: the power semiconductor device is bonded to the heat-conducting substrate 3, and the heat generated by the power semiconductor device is transferred to the heating end of the internal heat pipe 1 through the heat-conducting substrate 3 and the heat-conducting insulating material 4. The vapor-liquid phase change of the medium in the heat pipe 1 transfers the heat to the heat dissipation end of the internal heat pipe 1, ...
Embodiment 3
[0032] Such as image 3 As shown, the difference between Embodiment 3 and Embodiment 1 and Embodiment 2 is that the flameproof structure insulation heat pipe radiator of Embodiment 3 is not provided with an external heat pipe cooling device in the outer space of the flameproof shell, but this implementation For example, a heat dissipation device for the flameproof housing is provided on the shell wall of the flameproof shell 2, that is, a fluid heat dissipation channel 7 is provided on the shell wall of the flameproof shell 2, and a heat dissipation fluid circulates in the fluid heat dissipation channel 7.
[0033] The heat dissipation process of the explosion-proof structure insulating heat pipe radiator of this embodiment: the power semiconductor device is bonded to the heat-conducting substrate 3, and the heat generated by the power semiconductor device is transferred to the heating end of the internal heat pipe 1 through the heat-conducting substrate 3 and the heat-conducti...
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