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A flameproof structure insulating heat pipe radiator

A heat pipe radiator and explosion-proof technology, which is applied in electric solid devices, semiconductor devices, cooling/ventilation/heating transformation, etc., can solve the limitation, limit the promotion of medium and high voltage electrical transmission devices, and cannot meet the insulation requirements of medium and high voltage electrical transmission devices. and other problems to achieve the effect of satisfying heat dissipation, insulation and explosion-proof

Inactive Publication Date: 2016-06-08
张永亮
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the insulation level of the power semiconductor device itself, the application of medium and high voltage electric transmission devices in some industries is also limited; because the outer shell of the heat pipe is a closed metal structure, which is a good conductor, the current flameproof equipment used The heat pipe radiator cannot meet the insulation requirements of medium and high voltage electric transmission devices, which limits the promotion of medium and high voltage electric transmission devices

Method used

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  • A flameproof structure insulating heat pipe radiator
  • A flameproof structure insulating heat pipe radiator
  • A flameproof structure insulating heat pipe radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, the flameproof structure insulation heat pipe radiator of the present embodiment includes: a flameproof casing 2, and the flameproof casing 2 divides the space into the internal space of the flameproof casing and the external space of the flameproof casing; The internal space of the body is provided with an internal heat pipe insulation and heat dissipation device. The internal heat pipe insulation and heat dissipation device includes a heat conduction substrate 3, and a substrate hole is provided inside the heat conduction substrate 3, and the extension direction of the substrate hole is consistent with the extension direction of the heat conduction substrate; the internal heat pipe 1 , the internal heat pipe 1 has a heating end and a heat dissipation end, wherein the heating end of the internal heat pipe 1 is penetrated in the substrate hole, and a thermally conductive insulating material 4 is ringed between the hole wall of the substrate hol...

Embodiment 2

[0029] Such as figure 2 As shown, the second embodiment is basically the same as the first embodiment, except that the internal heat pipe 1 and the external heat pipe 8 are arranged separately, and both are in the shape of a horizontal "L". The heat dissipation end of the inner heat pipe 1 is fixed on the inner wall of the flameproof casing 2 , and the heated end of the outer heat pipe 8 is fixed on the outer wall of the flameproof casing 2 .

[0030] The heat dissipation process of the explosion-proof structure insulating heat pipe radiator of this embodiment: the power semiconductor device is bonded to the heat-conducting substrate 3, and the heat generated by the power semiconductor device is transferred to the heating end of the internal heat pipe 1 through the heat-conducting substrate 3 and the heat-conducting insulating material 4. The vapor-liquid phase change of the medium in the heat pipe 1 transfers the heat to the heat dissipation end of the internal heat pipe 1, ...

Embodiment 3

[0032] Such as image 3 As shown, the difference between Embodiment 3 and Embodiment 1 and Embodiment 2 is that the flameproof structure insulation heat pipe radiator of Embodiment 3 is not provided with an external heat pipe cooling device in the outer space of the flameproof shell, but this implementation For example, a heat dissipation device for the flameproof housing is provided on the shell wall of the flameproof shell 2, that is, a fluid heat dissipation channel 7 is provided on the shell wall of the flameproof shell 2, and a heat dissipation fluid circulates in the fluid heat dissipation channel 7.

[0033] The heat dissipation process of the explosion-proof structure insulating heat pipe radiator of this embodiment: the power semiconductor device is bonded to the heat-conducting substrate 3, and the heat generated by the power semiconductor device is transferred to the heating end of the internal heat pipe 1 through the heat-conducting substrate 3 and the heat-conducti...

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Abstract

The invention discloses an insulated heat pipe radiator with a flameproof structure, which comprises: a flameproof casing, an internal heat pipe insulation and heat dissipation device is arranged in the inner space of the flameproof casing, the internal heat pipe insulation and heat dissipation device includes a heat conduction substrate, and the heat conduction substrate There is a substrate hole in the same extending direction inside the inner heat pipe, the heated end of the internal heat pipe is penetrated in the substrate hole, and the heat dissipation end is fixed on the inner wall of the flameproof casing or passes out of the flameproof casing; between the substrate hole and the inside A thermally conductive insulating material is provided between the heated ends of the heat pipe to enable heat transfer and mutual insulation between the thermally conductive substrate and the internal heat pipe, and an insulation monitor to detect the insulation performance of the thermally conductive insulating material. An external heat pipe cooling device is provided outside the flameproof casing or a flameproof casing cooling device is arranged on the shell wall of the flameproof casing. The flameproof structure insulating heat pipe radiator of the invention can simultaneously meet the requirements of heat dissipation, insulation and flameproofing, and can be popularized and applied in flameproof medium and high voltage electric transmission devices.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to a heat pipe heat sink with flameproof structure insulation. Background technique [0002] As a heat-conducting element with extremely high thermal conductivity, the heat pipe transfers heat through the vapor-liquid phase change of the medium in the vacuum tube with a certain degree of vacuum at room temperature in a fully enclosed room, and has extremely high thermal conductivity; the heating end of a general heat pipe is called The hot end and the cooling end are called the cold end. Heat sinks with heat pipes as the core are widely used in the heat dissipation of power semiconductors. With the development of electric transmission technology using power semiconductors as power devices, medium and high voltage electric transmission devices have become popular. However, due to the limitation of the insulation level of the power semiconductor device itself, the application of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H05K7/20
Inventor 张永亮
Owner 张永亮
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