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electronic device

A technology for electronic devices and connectors, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of concentrated force, affecting the normal operation of the CPU, etc., and achieve the effect of avoiding warping and deformation

Inactive Publication Date: 2016-06-08
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the cooling device abuts against the top surface of the chip at the center of the CPU, the limited contact area will cause the CPU to be concentrated when an external force is applied, causing the peripheral parts of the chip to warp and deform to varying degrees, thereby affecting the performance of the CPU. normal operation

Method used

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Embodiment Construction

[0015] The phase change heat dissipation device of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0016] see Figure 1 to Figure 3 , the electronic device 100 of a preferred embodiment of the present invention, it comprises a connector 10, the electronic component 20 that is located in this connector 10, the heat dissipation device 30 that is connected with this electronic component 20, fixing member 40 and this electronic The device 100 is fixed to a component 50 of a motherboard (not shown).

[0017] Specifically, the connector 10 includes a square flat bottom plate 11 and two sidewalls 12 vertically extending upwards from two opposite edges of the bottom plate 11 . The other two opposite edges of the bottom plate 11 that are perpendicular to the two side walls 12 first extend outwards and then vertically upwards to form a stop block 13 and a positioning block 14. The stop block 13 formed on each edge is comp...

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PUM

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Abstract

An electronic device comprises a vapor chamber, a connector and an electronic element arranged in the connector. The electronic element comprises a substrate and a chip arranged in the center of the substrate. The lower surface of the vapor chamber is connected with the chip in an abutting mode. The electronic device further comprises a group of elastic fixing pieces. One end of each fixing piece is connected with the vapor chamber in an abutting mode, and the other end of each fixing piece is connected with the substrate or the connector in an abutting mode. Compared with the prior art, the elastic fixing pieces are connected between the lower surface of the vapor chamber and the substrate or the connector in an abutting mode. When the electronic device is fixed on a main machine plate, external force which is concentrated at the chip originally is changed to be distributed on the chip and the external fixing pieces thereof at the same time, so that the fixing pieces share stress of the chip, and buckling deformation of the periphery edge of the substrate caused by the fact that stress of the chip is too large is avoided.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device with an elastic fixing part. Background technique [0002] With the advancement of science and technology, many electronic components have tended to be miniaturized and high-speed. Especially the microprocessor (CPU) in computer products has attracted consumers to buy it with its newer and faster features. However, the higher the speed of the CPU, the higher the heat generated. If the heat cannot be taken away from the CPU in time, it will often cause the computer to crash, and even the CPU will be damaged due to overheating. In view of this feature, it is quite a common design to install a cooling device thermally connected to the CPU to dissipate heat in a timely manner. [0003] In order to facilitate the replacement / removal of the CPU, the industry generally first accommodates the CPU in a connector, and then fixes the connector on the motherboard, and then makes ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/40
Inventor 陈荣安
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD