Manufacturing method of multi-layer PCB (printed circuit board)

Abstract

A manufacturing method of a multi-layer PCB comprises the steps as follows: 1), board cutting is performed, so that a jointed board is formed; 2), an inner-layer image is transferred; 3), inner-layer press fit is performed; 4), a target point is manufactured: a part of an exposed inner-layer copper foil of an inner-layer circuit image is manufactured into a special image, so that the target point is manufactured; 5), lamination is performed; 6), the inner-layer image is captured: a CCD (charge coupled device) image sensor is used for capturing the target point on the inner-layer copper coil, and position information of the target point is stored in a computer; 7), an outer-layer image is transferred: the target point on the inner-layer copper foil is captured through the CCD image sensor and taken as a reference, and an outer-layer circuit image is formed; 8), drilling is performed; and 9), chemical copper deposition is performed, and the inner-layer circuit image and the outer-layer circuit image are conducted. The target point is manufactured on a part of the copper foil of the inner-layer circuit image, and when the outer-layer image is transferred, the target point on the inner-layer copper foil is taken as a reference, so that the accuracy of the outer-layer circuit image and the inner-layer circuit image is guaranteed.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer board, in particular to a method for manufacturing a PCB multilayer board. Background technique [0002] At present, in the industry, when the outer layer image of the PCB multilayer board is produced, the outer layer image transfer is usually positioned by the outer layer hole, and the alignment between the inner layer circuit layer and the outer layer circuit layer is generally between 4-5mil. In the subsequent drilling step, this method has the problem that the hole is offset from the inner layer pattern. It can meet the requirements for ordinary products, but for products with a small unit (about 2mm), it can no longer meet the requirements, and it is easy to cause the PCB multilayer board to fail to work normally. Contents of the invention [0003] Based on this, it is necessary to provide a method for manufacturing a PCB multilayer board to address the deficiencies in the prior a...

AI Technical Summary

Problems solved by technology

It can meet the requirements for ordinary products, but for products with a small unit (about 2mm), it can no longer meet the requirements, and it is easy to cause the PCB multilayer board to not work normally.

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