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A Modular Processing Method of Cutting Process Based on Laser Cutting Software

A laser cutting and cutting process technology, applied in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems that the parameters cannot meet the cutting plate and process, and the parameters cannot be set flexibly, and achieve a convenient and fast setting and saving method. , The effect of facilitating copying and transplanting and reducing the probability of burning corners

Active Publication Date: 2016-07-20
上海柏楚电子科技股份有限公司
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Problems solved by technology

[0004] In order to overcome the deficiencies of the prior art, the present invention designs a set of convenient and efficient parameter modular setting method in the laser cutting software to solve the problem that parameters cannot be set flexibly and a single parameter cannot satisfy various cutting plates and processes, and at the same time provide users with Customize the method to achieve a set of parameters to meet customer needs in any environment, any process and cutting mode of the plate

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  • A Modular Processing Method of Cutting Process Based on Laser Cutting Software
  • A Modular Processing Method of Cutting Process Based on Laser Cutting Software
  • A Modular Processing Method of Cutting Process Based on Laser Cutting Software

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[0027] The present invention will be further described below according to the accompanying drawings.

[0028] Such as figure 1As shown, the CypCut laser cutting software is used for layer editing, and then the plate cutting process is performed. The processing steps of the layer editing described are as follows: (1) enter the edit layer dialog box; (2) establish the global parameter structure (3) Save the global parameter structure; (4) establish the layer parameter structure; (5) pre-set the layer parameters; (6) save the layer parameters; (7) save the layer parameter structure to the material library; (8) exit; The establishment of the global parameter structure described above is respectively provided with the establishment of a motion parameter library, peripheral control parameters, and the establishment of a PLC process library. In the described motion parameter library, the 10mm reference circle speed for space movement, edge detection, and turning is set respectively; ...

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Abstract

The invention relates to the technical field of laser cutting processing, in particular to a cutting technology modularization processing method based on laser cutting software. The cutting technology modularization processing method is characterized in that CypCut laser cutting software is used for conducting layer editing, and then plate cutting is conducted. Layer editing includes the processing steps of (1) entering a layer editing dialog box; (2) building an overall parameter structure; (3) storing the overall parameter structure; (4) building a layer parameter structure; (5) conducting layer parameter presetting; (6) storing layer parameters; (7) storing the layer parameter structure in a material library; (8) exiting. Compared with the prior art, power can be adjusted in real time according to speed in an actual cutting process. All stored layer information texts make up the material library, the material library is stored in a computer in a form of a file and facilitates copying and moving, and the problem that one machine can only use its own material library is solved.

Description

technical field [0001] The invention relates to the technical field of laser cutting processing, in particular to a cutting process modular processing method based on laser cutting software. Background technique [0002] CypCut laser cutting software is a set of laser cutting software independently developed by the present invention, and the layer is a module for processing and process parameter setting in the laser cutting software. During the laser cutting process, the cutting process and motion parameters of different plates are not the same. The setting of cutting parameters will directly affect the effect of plate cutting. However, the setting of these parameters is done bit by bit in the actual cutting process. Debugged, including the cutting method, speed, power, air pressure and delay, etc., the change of each parameter may affect the final effect of plate cutting. There are great differences in the cutting parameters used by different types of plates of different m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38G05B19/18
CPCB23K26/38G05B19/18
Inventor 代田田阳潇恽筱源周荇杨撷成
Owner 上海柏楚电子科技股份有限公司
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