Substrate transmitting device

Abstract

The invention provides a substrate transmitting device, suitable to transmit a substrate. The substrate transmitting device comprises a carrier, a driving device, a slideway group and a sliding block group. The carrier is used to support the substrate. The driving device provides power needed to transmit the substrate. The slideway group and the sliding block group are disposed between the carrier and the driving device. The slideway group and the sliding block group can move relative to each other. The slideway group is provided with a first slideway and a second slideway. A first section and a second section of the slideway group are defined. When the substrate is on the first section of the slideway group, width of the substrate is a first width. When the substrate is on a second section of the slideway group, width of the substrate is a second width, wherein the first width is different from the second width. When the substrate moves between the first section and the second section of the slideway group, surface tension of the substrate is changed.

Description

technical field [0001] The invention relates to a substrate conveying device, in particular to a device capable of uniformly carrying out chemical reactions on the substrate surface during the substrate conveying process. Background technique [0002] Thin film material properties are greatly affected by the manufacturing process. In order to greatly change the composition and structure of thin film materials in an equilibrium state to produce new characteristics, most of the thin film materials are in an unbalanced state in the production process of thin film materials. The chemical bath deposition (Chemical Bath Deposition, CBD) process is one of the thin film material processes. [0003] The existing chemical bath deposition process is one of the deposition techniques. In the existing chemical bath deposition process, a pre-treated substrate (such as a stainless steel plate, etc.) is immersed in a chemical solution for a certain period of time to form a semiconductor fi...

AI Technical Summary

Problems solved by technology

The uneven pressure of the above-mentioned substrate will lead to uneven chemical reactions on the substrate surface, such as uneven deposition during the chemical bath deposition process

Therefore, the structure of the substrate surface is not uniform after the chemical reaction of the substrate with uneven pressure.

For example, after a substrate with uneven pressure undergoes a chemical bath deposition process, the thickness of the semiconductor film deposited on the substrate is uneven

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