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Alignment device and alignment method

An alignment device and alignment mark technology, which is applied in the field of integrated circuit manufacturing, can solve the problems of large space occupation and poor flexibility, and achieve the effects of increasing production capacity, reducing weight, and reducing depth

Active Publication Date: 2016-02-03
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an alignment device and an alignment method to solve the problems of the prior art that the back alignment occupies a large space and has poor flexibility

Method used

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  • Alignment device and alignment method

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Embodiment Construction

[0034] The alignment device and alignment method provided by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form, and are only used for the purpose of conveniently and clearly assisting in describing the embodiments of the present invention.

[0035] Please refer to figure 1 , an alignment device comprising:

[0036] Wafer stage 1, the wafer stage 1 includes a bottom platform (stage) 1a and a chuck (chuck) 1b located on the platform 1a, the chuck 1b is used to clamp a workpiece 12, and the back of the workpiece 12 has alignment Marking, the chuck 1b has at least one groove 2; in order to better align, preferably, the design of two grooves 2 is adopted, and the two grooves 2 can be located at opposite positions (here...

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Abstract

The invention discloses an alignment device and an alignment method. The detectable area on the back face of silicon slice is increased by using a polarized light source and an imaging lens. Thus, the depth of a groove can be reduced under the condition that the same detection area is required, so that the thickness of a chuck is effectively reduced, and further the weight of the chuck is reduced. Finally, the stability during variable motion is improved, the exposure speed and the photo-etching accuracy are improved, and further the yield is improved.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to an alignment device and an alignment method applied to photolithography. Background technique [0002] In the field of integrated circuit manufacturing, photolithography is the most critical process step among the four basic processes. Lithography determines the critical dimensions of the device, which is a high-tech version of photography and needs to be done at very small dimensions, so lithography alignment is very important. If there is a problem in the photolithographic alignment, it may cause distortion of the pattern or poor overlay accuracy, which will eventually affect the electrical characteristics of the device. [0003] In projection lithography machines, the backside alignment method is more commonly used. The U.S. patent with document number US2006 / 0007441A1 describes a back alignment method, which uses 3DAlignOptics (3-dimensional alignment optical...

Claims

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Application Information

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IPC IPC(8): G03F7/20G03F9/00
Inventor 张俊
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD