Soldering flux supply mechanism for substrate ball mounter

A technology of flux and ball mounting, applied in the field of flux supply mechanism of substrate ball mounting machine, can solve the problems of corroding the flux supply mechanism, reducing the service life, and inability to adjust the thickness of the flux, and achieves the effect of convenient cleaning and corrosion prevention.

Active Publication Date: 2014-03-05
SHANGHAI WEISONG IND AUTOMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The thickness of the applied flux cannot be adjusted, resulting in some products greatly reducing the ball planting success rate of the entire device due to the glue application process
[0004] 2. The plastic boxes of some existing flux supply mechanisms canno

Method used

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  • Soldering flux supply mechanism for substrate ball mounter
  • Soldering flux supply mechanism for substrate ball mounter
  • Soldering flux supply mechanism for substrate ball mounter

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Embodiment Construction

[0020] see figure 1 , figure 2 , image 3 , The flux supply mechanism of the substrate ball planting machine of the present invention includes a bottom bracket, a glue supply mechanism installed above the bottom bracket, a power mechanism installed below the bottom bracket, and a glue scraping mechanism installed on the power mechanism.

[0021] The bottom bracket includes two support plates 1 and a support platform 2 erected on the two support plates.

[0022] The glue supply mechanism includes a glue supply box 3; the glue supply box is installed on the support platform 2.

[0023] The power mechanism includes a motor and a transmission belt 4, and the power mechanism is installed on two support plates 1.

[0024] The squeegee mechanism includes a squeegee base plate 5 , a left squeegee cylinder 6 , a right squeegee cylinder 7 , a left squeegee 8 and a right squeegee 9 . The squeegee base plate 5 is installed on the transmission belt 4 of the power mechanism and can rec...

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Abstract

A soldering flux supply mechanism for a substrate ball mounter comprises a bottom support, a glue supply mechanism installed above the bottom support, a power mechanism installed below the bottom support and a glue scraping mechanism installed on the power mechanism. The glue supply mechanism comprises a glue supply box. The power mechanism comprises a motor and a transmission belt. The glue scraping mechanism comprises a glue scraping knife base plate, a left side glue scraping knife cylinder, a right side glue scraping knife cylinder, a left side glue scraping knife and a right side glue scraping knife. The glue supply thickness can be adjusted according to micrometer calipers of the glue scraping knives to conveniently correspond to different kinds of substrates. The glue scraping knives and a soldering flux supply box can be dismantled randomly, cleaning of soldering flux is facilitated, and the corrosion to a device during the cleaning is avoided. The soldering flux supply mechanism is provided with a remaining glue detection sensor to detect the remaining amount of the soldering flux in the two glue scraping knives, operators are reminded to add the soldering flux when the remaining amount is insufficient, and the problem that the substrate ball mounter still continues running without supplementing the soldering flux when no soldering flux is available is solved.

Description

technical field [0001] The invention relates to semiconductor production equipment, in particular to a flux supply mechanism for a substrate ball planting machine. Background technique [0002] With the rapid development of the semiconductor industry, the semiconductor industry is also growing at a high speed. In the semiconductor back-end process, the development of fully automatic ball planting machines is also changing with each passing day. The flux supply mechanism in the ball planting machine equipment has a great influence on the final ball planting success rate of the equipment. The existing flux supply mechanism mostly adopts an integral flux plastic box, and its flux supply has the following defects: [0003] 1. The thickness of the applied flux cannot be adjusted, resulting in some products greatly reducing the ball planting success rate of the entire device due to the glue application process. [0004] 2. The plastic boxes of some existing flux supply mechanism...

Claims

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Application Information

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IPC IPC(8): B23K37/00
CPCB23K3/082
Inventor 刘劲松林海涛任永军
Owner SHANGHAI WEISONG IND AUTOMATION
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