Soldering flux supply mechanism for substrate ball mounter

Abstract

A soldering flux supply mechanism for a substrate ball mounter comprises a bottom support, a glue supply mechanism installed above the bottom support, a power mechanism installed below the bottom support and a glue scraping mechanism installed on the power mechanism. The glue supply mechanism comprises a glue supply box. The power mechanism comprises a motor and a transmission belt. The glue scraping mechanism comprises a glue scraping knife base plate, a left side glue scraping knife cylinder, a right side glue scraping knife cylinder, a left side glue scraping knife and a right side glue scraping knife. The glue supply thickness can be adjusted according to micrometer calipers of the glue scraping knives to conveniently correspond to different kinds of substrates. The glue scraping knives and a soldering flux supply box can be dismantled randomly, cleaning of soldering flux is facilitated, and the corrosion to a device during the cleaning is avoided. The soldering flux supply mechanism is provided with a remaining glue detection sensor to detect the remaining amount of the soldering flux in the two glue scraping knives, operators are reminded to add the soldering flux when the remaining amount is insufficient, and the problem that the substrate ball mounter still continues running without supplementing the soldering flux when no soldering flux is available is solved.

Description

technical field [0001] The invention relates to semiconductor production equipment, in particular to a flux supply mechanism for a substrate ball planting machine. Background technique [0002] With the rapid development of the semiconductor industry, the semiconductor industry is also growing at a high speed. In the semiconductor back-end process, the development of fully automatic ball planting machines is also changing with each passing day. The flux supply mechanism in the ball planting machine equipment has a great influence on the final ball planting success rate of the equipment. The existing flux supply mechanism mostly adopts an integral flux plastic box, and its flux supply has the following defects: [0003] 1. The thickness of the applied flux cannot be adjusted, resulting in some products greatly reducing the ball planting success rate of the entire device due to the glue application process. [0004] 2. The plastic boxes of some existing flux supply mechanism...

AI Technical Summary

Problems solved by technology

[0003] 1. The thickness of the applied flux cannot be adjusted, resulting in some products greatly reducing the ball planting success rate of the entire device due to the glue application process

[0004] 2. The plastic boxes of some existing flux supply mechanisms cannot be disassembled, which makes it very inconvenient to clean up. The remaining glue in the plastic boxes cannot be cleaned cleanly, which will corrode the flux supply mechanism for a long time, resulting in increased instability of the mechanism. Reduced service life

Images