Apparatus for the manufacture of bakery products

A baking and product technology, applied in the field of crisp wafers or soft wafers, can solve the problems of unusable baked products, damage to mechanical parts, and waste products in the oven

Active Publication Date: 2017-03-01
HAAS FOOD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, due to contamination - for example due to adhering baking residues - multiple injections (Mehraufguss) can occur on the baking tray, whereby not only the baked product becomes unusable, but also mechanical parts of the baking tray and tongs (Zangenwagen) can be damaged
[0005] Until now, many such disturbances in the roasting process could only be detected after the roasting process on the basis of defective baked products, so that especially in fast-running ovens there is a large amount of rejects

Method used

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  • Apparatus for the manufacture of bakery products
  • Apparatus for the manufacture of bakery products
  • Apparatus for the manufacture of bakery products

Examples

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Embodiment Construction

[0027] Figures 1 to 3 A baking tray according to the invention is shown, the basic construction of which corresponds to the prior art. The illustrated embodiment shows an upper baking tray 1 and a lower baking tray 2 , wherein this is a self-supporting baking tray which does not require support frames. In the closed state shown, the two baking trays are close together on the baking surface to such an extent that only the required gap 4 for the dough to be baked remains between the baking surfaces. The baking surface can be provided with grooves in a known manner, as is known from flat wafers or soft wafers. Groove in Figures 1 to 3 not shown in

[0028] as in figure 2 As shown in cross-section in , the upper baking tray has a sensor arrangement 5 in the form of a separate sensor 6 . The sensor 6 is arranged in the baking tray in the sensor receiving opening 7 , wherein in this embodiment the sensor extends with its sensor head 8 as far as the adjacent baking surface 3 ...

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Abstract

The invention relates to a device for producing baked products, in particular edible crisp wafers or soft wafers, wherein at least one baking tray (1, 2) is provided, the baking surface of which can be baked at a temperature of heating, characterized in that the baking tray has a sensor device (5) for detecting the temperature of the baking tray (1,2) and / or detecting the baking surface (3) acting on the baking tray (1,2) during the baking process ) on the pressure.

Description

technical field [0001] The invention relates to a device for producing baked products, in particular edible crisp wafers or soft wafers, wherein at least one baking tray is provided which is preferably moved through the baking chamber during baking, Its baking surface can be heated by baking temperature. Background technique [0002] Such a device is especially a wafer oven. Wafer ovens with circulating baking tongs have been known for a long time for the industrial production of wafers of any type. Furthermore, it is also known so far to measure and adjust the oven temperature to achieve a good roasting process. However, current temperature measurements have only been performed indirectly by means of infrared heat sensors (Infrarotwärmesensors, which are arranged in the oven cavity and measure the temperature, for example, on the back of the baking tray). The disadvantage here is the great inertia of the system, and the temperature measurement gives no information on the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A21B1/42
CPCH04Q9/00A21B5/023A21B1/46A21B1/42A21B3/00
Inventor J.哈亚斯S.杰拉斯彻克M.科普夫
Owner HAAS FOOD EQUIP
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