Large-area special-shaped wafer uniformity control device
A control device and large-area technology, which is applied in semiconductor/solid-state device manufacturing, photoengraving process coating equipment, electrical components, etc. Performance and production efficiency, preventing uneven glue distribution, and easy-to-achieve effects
Active Publication Date: 2016-03-23
北京中科飞鸿科技股份有限公司
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Problems solved by technology
[0003] The purpose of the present invention is to provide a large-area special-shaped wafer coating uniformity control device that can solve the problem of uneven coating of large-area special-shaped substrates
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[0017] Such as figure 1 As shown, including the carrier platform 1, a positioning groove 4 is set at the center of the upper surface of the carrier platform 1, the size is consistent with the substrate, and two positioning steps 5 are set in the length direction of the positioning groove for substrate positioning; A vacuum groove 2 is arranged inside the positioning groove 4, similar in shape to the substrate, smaller in size than the substrate, and 0.5 mm in depth, for better vacuuming and adsorption of the substrate; two arcs are arranged on both sides of the positioning groove 4 in the width direction Shaped baffle 3, the length of which is consistent with the length of the substrate, the arc length is 1.5 cm, and the center of the arc-shaped baffle points to the center of the substrate platform, which is used to control the air flow around the substrate and effectively prevent the end surface of the special-shaped substrate from being evenly glued. The problem of unevennes...
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Abstract
The invention discloses a large-area special-shaped wafer glue coating uniformity control device, comprising a wafer supporting platform, wherein the center position of the upper surface of the wafer supporting platform is provided with a positioning groove running through the wafer supporting platform, the two ends of the positioning groove in the length direction are provided with a positioning step respectively, a vacuum groove is arranged inside the positioning groove, the bottom of the vacuum groove is provided with a vacuuming hole, the two sides of the positioning groove in the width direction are provided with an arc-shaped baffle respectively, and the arc-shaped circle centers of the arc-shaped baffles are pointed to the center direction of the wafer supporting platform. The large-area special-shaped wafer glue coating uniformity control device can be used for effectively preventing glue coating nonuniformity of the end faces of the special-shaped wafer and obviously improving the performance and the production efficiency of a semiconductor wafer, and also has the characteristics of low cost and easiness in realization.
Description
technical field [0001] The invention relates to a substrate carrying device of semiconductor processing equipment, in particular to a device for controlling the uniformity of glue uniformity of large-area special-shaped wafers. Background technique [0002] With the rapid development of semiconductor technology, the commonly used circular substrates can no longer meet the production needs, and various rectangular, square and other special-shaped substrates have begun to emerge in endlessly, and the conventional spin-coating type coating is easy to cause uneven coating on the end surface of special-shaped substrates. Average, which limits the improvement of the production pass rate. Contents of the invention [0003] The object of the present invention is to provide a large-area special-shaped wafer coating uniformity control device which can solve the problem of uneven coating of large-area special-shaped substrates. [0004] The purpose of the present invention is achiev...
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IPC IPC(8): H01L21/687H01L21/68H01L21/683G03F7/16
CPCG03F7/16H01L21/68H01L21/68785
Inventor 黄歆张雅陈明和杨思川
Owner 北京中科飞鸿科技股份有限公司