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Touch panel and manufacturing method thereof

A technology of touch panel and manufacturing method, which is applied in the direction of instruments, electrical digital data processing, and input/output process of data processing, etc., which can solve the problem of affecting the manufacturing yield, destroying the joint of flexible circuit boards, and consuming human resources and working hours And other issues

Inactive Publication Date: 2014-03-26
RTR TECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in order to match the arrangement relationship among the various components in the electronic device, the flexible circuit board 11 often needs to be bent, and when the flexible circuit board 11 is deformed by bending, it is easy to generate stress, and it can be used for a long time. may damage the bond between the flexible circuit board 11 and the substrate 10
In addition, because the known touch panel 1 has an additional component of the flexible circuit board 11, not only the manufacturing cost is high, but also consumes manpower resources and man-hours, and easily affects the manufacturing yield.

Method used

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  • Touch panel and manufacturing method thereof
  • Touch panel and manufacturing method thereof

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Embodiment Construction

[0022] The following only uses a capacitive touch panel for illustration, but the present invention is not limited thereto, and the present invention is also applicable to a resistive touch panel or other touch panels that need both a substrate and a connecting terminal. Please also see figure 1 and figure 2 , figure 1 It is a front view of a preferred embodiment of the touch panel of the present invention, figure 2 It is a schematic diagram of the touch panel of the present invention configured on the liquid crystal panel.

[0023] As shown in the figure, the touch panel of this embodiment mainly includes a flexible substrate 2 and a cover plate 4, wherein the flexible substrate 2 includes a touch area 21, a connection terminal area 22 and a wiring area 23, and the wiring The area 23 surrounds the touch area 21, the connection terminal area 22 protrudes from one side of the flexible substrate 2 and is used to electrically connect to the main board 3, and the cover plat...

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PUM

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Abstract

The present invention provides a touch panel and a manufacturing method thereof. According to the touch panel, an integral flexible substrate is adopted for finishing touch control, wiring and electric connection function are realized. The flexible substrate comprises a touch control area, a connecting terminal area and a wiring area. The wiring area at least partially surrounds the touch control area. The connecting terminal area integrally projects out of one side of the flexible substrate and is used for electrically connecting with a main board. The touch panel of the invention can totally save an additional flexible circuit board which is required in the well-known touch panel. According to the manufacturing method for the touch panel provided by the invention, induction rows of the touch control area and wirings of the wiring area and the connecting terminal area can be simultaneously formed on the integral flexible substrate, thereby greatly reducing cost, shortening manufacturing labor hour and human resource, and improving yield rate.

Description

technical field [0001] The invention relates to a touch panel and a manufacturing method thereof, in particular to a touch panel suitable for a touch screen and a manufacturing method thereof. Background technique [0002] see first Figure 7 , Figure 7 It is an exploded view of a known touch panel. As shown in the figure, the known touch panel 1 mainly includes a substrate 10 and a flexible circuit board 11 . Among them, a plurality of touch component arrays 12 and a plurality of lead wires 13 are arranged on the substrate 10, and one ends of the plurality of lead wires 13 are respectively electrically connected to the plurality of touch component arrays 12, and the other ends of the plurality of lead wires 13 are extended to a bonding area 14 . [0003] On the other hand, the same number of leads 111 as the plurality of leads 13 are arranged on the flexible circuit board 11, and the flexible circuit board 11 is pasted on the bonding area 14 of the substrate 10, and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
Inventor 陈维钏郭晓文
Owner RTR TECH TECH
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