Manufacturing technology of diodes

A preparation process and technology for diodes, which are used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as long production time, insufficient automation, and hidden dangers in products

Active Publication Date: 2014-03-26
CHANGZHOUSR SEA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing diode products often have hidden dangers to the product, such as bending corners, in the production process. The reliab

Method used

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  • Manufacturing technology of diodes
  • Manufacturing technology of diodes

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Embodiment Construction

[0036] A kind of preparation technology of diode, comprises the following steps,

[0037] (1) Prepare the bottom sheet with the left frame strip and the right frame strip, the core storage tray with the core particles, and the tape-and-reel top sheet with the bridge piece;

[0038] (2) The dispensing machine performs dispensing operations on the left frame strip and the right frame strip, so that the upper surfaces of the left frame strip and the right frame strip are glued with solder paste;

[0039] (3) Use the chip pick-and-place mechanism to take out the chip from the chip storage tray and place it on the solder paste on the right frame bar;

[0040] (4) The dispensing machine applies glue to the core particles on the right frame strip, so that the upper surface of the core particles is glued with solder paste;

[0041] (5) Use the bridge pick-and-place mechanism to cut the bridge from the tape-type upper material and place it on the bottom material, so that one end of th...

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Abstract

The invention relates to a manufacturing technology of diodes. The manufacturing technology of the diodes mainly comprises the operation steps that firstly, a left frame strip, a right frame strip, a core granule and a bridge sheet are assembled together through the gumming technology, and then welding, cleaning, drying, packaging, cleaning, drying, detection, tinning on the exposed parts of the frame strips, drying and packaging are carried out. The diodes manufactured according to the manufacturing technology of the diodes are in the straight angle and surface mounting mode, processes such as bent angles forming a hidden danger for the diodes do not exist in the whole production process, and the consistence of the reliability performance of the diodes is high; the bridge connection technology is adopted, and the performance of the diodes is improved. Mechanical automation can be achieved for all the steps, and the manufacturing technology of the diodes is high in production efficiency, stable and reliable.

Description

technical field [0001] The invention relates to a process for preparing a diode. Background technique [0002] Existing diode products often have hidden dangers to the product, such as corner bending, in the production process. The reliability of the produced product is not ideal, and the degree of automation is not high enough, and the production time is relatively long. Contents of the invention [0003] The purpose of the present invention is to provide a diode preparation process with high automation and high reliability. [0004] The technical scheme that realizes the object of the present invention is as follows: [0005] A kind of preparation technology of diode, comprises the following steps, [0006] (1) Prepare the bottom sheet with the left frame strip and the right frame strip, the core storage tray with the core particles, and the tape-and-reel top sheet with the bridge piece; [0007] (2) The dispensing machine performs dispensing operations on the left fr...

Claims

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Application Information

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IPC IPC(8): H01L21/329H01L21/50
CPCH01L24/90H01L29/6609H01L2224/83385H01L2224/83801H01L2224/84345H01L2224/84385H01L2224/84801H01L2924/181H01L2224/37147H01L2224/40245H01L2224/32245H01L2924/00012
Inventor 何永成刘伟
Owner CHANGZHOUSR SEA ELECTRONICS
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