The Design Method of Punching Alignment Target

Abstract

The invention discloses a designing method of a punching alignment target. The designing method comprises the following steps that an original wire distribution graph is designed on a computer, wherein the original wire distribution graph comprises a punching alignment target graph; the original graph scale of the part of the punching alignment target graph in the original wire distribution graph is maintained, and expansion and contraction are conducted on the other parts in the wire distribution graph to obtain an expansion and contraction wire distribution graph. The expansion and contraction wire distribution graph is transferred onto a film, and a film graph is obtained accordingly. The designing method is beneficial for improving the punching precision.

Description

technical field [0001] The invention relates to a design method of a punching alignment target applied to a multilayer circuit board. Background technique [0002] With the development of electronic products towards miniaturization, multi-function and high integration, multi-layer boards have already become the mainstream of circuit boards. The number of layers of multi-layer boards is getting higher and higher, the wiring density is getting higher and higher, and the requirements for alignment accuracy between layers are getting higher and higher. The multi-layer board is formed by pressing multiple inner core boards. The inner core boards are designed with conductor patterns. The inner core boards are all punched first, and then aligned with the punched holes for binding or riveting, etc. , to ensure the alignment accuracy of the interlayer conductor pattern. Therefore, the accuracy of punching has a great influence on the final alignment accuracy between layers. The pu...

AI Technical Summary

Problems solved by technology

[0004] (1) Since the distance between the CCD lens is 1:1, the punching alignment target and the CCD lens are not in the same vertical position, which will have a certain impact on the accuracy of the CCD lens to capture the graphics, and then affect the punching accuracy

[0005] (2) The punching target pattern is not 1:1, and the multi-layer board punching machines used in the industry are all 1:1 punching, resulting in a certain offset of the punched hole relative to the pattern, because the punching machine sometimes Punching deviation will occur, it is difficult to judge whether the deviation is normal or there is a problem with the punching accuracy during manual inspection

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