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A drilling method for a high-thickness-diameter ratio plate

A technology with high aspect ratio and manufacturing method, applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as the inability to meet the requirements of high-precision positioning of PCB boards, and achieve high drilling accuracy, high product quality, The effect of high product qualification rate

Active Publication Date: 2016-07-27
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the number of board layers is getting higher and higher, and the distance between holes and lines is getting closer, the traditional drilling method will not be able to meet the requirements of PCB boards for high-precision positioning.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1, a drilling method for a plate with a high thickness-to-diameter ratio, comprising the following steps:

[0020] Step S101, providing multiple core boards for making PCB boards, adding two or more first targets on the first core boards, and adding two or more second targets on the second core boards.

[0021] The purpose of drilling holes on the PCB is to electrically connect the circuit patterns of two or more core boards. The PCB board is drilled according to the graphic design requirements of each layer of the circuit. First, select a plurality of core boards for making PCB, at least a part of the core boards are arranged with circuit patterns, select two core boards in the plurality of core boards, these two core boards correspond to two circuit patterns respectively, use more than two first The target is added on the first core board of the two core boards, and more than two second targets are added on the second core board of the two core boards. In...

Embodiment 2

[0033] Embodiment 2, a drilling method for a plate with a high thickness-to-diameter ratio, comprising the following steps:

[0034] Step S201, providing multiple core boards for making PCB boards, dividing the multiple core boards for making PCB boards into multiple adjacent core boards as the first part and the remaining adjacent core boards as the second part, comparing the Describe the size of the positioning accuracy requirements of each core board in the first part of the core boards, and compare the size of the positioning accuracy requirements of each of the core boards in the second part of the core boards. As the first core board, the core board that requires the greatest positioning accuracy in the second part of the core boards is used as the second core board.

[0035] Before laminating multiple core boards to form a multi-layer core board, divide the multi-layer core board into two core boards, the first part and the second part, compare the positioning accuracy ...

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PUM

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Abstract

The invention discloses a method for drilling a board with a high aspect ratio. The method includes the steps of providing a core veneer, adding a first target and a second target, manufacturing an inner layer line graph, forming a multi-layer core veneer in a laminated mode, punching the first target and the second target to form a first positioning hole and a second positioning hole respectively, obtaining the position of a line graph of a first core veneer according to the position of the first positioning hole, determining the first position of drilling, drilling a part of the layered core veneer from one face of the multi-layer core veneer to an inner layer core veneer according to the first position to obtain a first drilling hole, obtaining the position of a line graph of a second core veneer according to the position of the second positioning hole, determining a second position of drilling according to the position of the line graph of the second core veneer, and drilling the rest layered core veneer from the other face of the multi-layer core veneer to the inner layer core veneer according to the second position to obtain a second drilling hole, wherein a through hole formed by the first drilling hole and the second drilling hole is a needed drilling hole. The method can greatly improve drilling accuracy of a PCB with the multi-layer core veneer.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a hole with a high thickness-to-diameter ratio. Background technique [0002] With the rapid development of printed circuit board technology, on the one hand, printed circuit boards are moving towards the direction of light, thin and short high-density interconnection, and on the other hand, they are moving towards the direction of multi-layer porous high reliability, such as semiconductor test boards. This type of high-reliability multi-layer thick board has a large number of layers and a thick board. The number of layers of some printed circuit boards is even about 60 layers, and the thickness of the board is about 10mm. The ratio of the thickness of the printed circuit board to the aperture (referred to as the thickness-to-diameter ratio) is above 15:1, and some are even 30: 1 or more. [0003] Due to the thickness of the high-t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 袁凯华袁处李艳国
Owner GUANGZHOU FASTPRINT CIRCUIT TECH