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Automatic moving track structure and moving system

A moving track and automatic technology, which is applied in the direction of conveyor objects, furnaces, lighting and heating equipment, etc., can solve the problems of OHT trolleys choosing the best path, creating troubles, increasing ceiling loads, affecting transfer efficiency, etc., to improve transfer efficiency , reduce the number of tracks, the effect of simple track structure

Inactive Publication Date: 2014-04-02
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Claims
  • Application Information

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Problems solved by technology

[0006] However, although the existing conveying system as described in the above-mentioned patent can realize the direct transportation of wafer cassettes between two machines, it needs to set up a complicated track structure, especially at least one track must be erected at each machine. This leads to complex track structure, increased ceiling load, and affects safety; on the other hand, numerous tracks also create trouble for the OHT car to choose the best path. There are many possible paths, which affect the transfer efficiency to a certain extent.

Method used

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  • Automatic moving track structure and moving system
  • Automatic moving track structure and moving system
  • Automatic moving track structure and moving system

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Embodiment Construction

[0026] see figure 1 and figure 2 The automatic transport track structure of this embodiment includes a plurality of transverse tracks 11 and a plurality of longitudinal tracks (not shown), and the longitudinal tracks include several moving tracks 13 whose two ends are connected to two transverse tracks and can translate along the transverse tracks. Wherein, two adjacent transverse rails 11 are connected at both ends of the moving rail 13 .

[0027] In this embodiment, the side of the transverse track 11 has a groove 111, the side of the moving track 13 has a raised bar 131, the groove 111 and the raised bar 131 form a guide rail, and the upper and lower surfaces of the raised bar 131 are also provided with a plurality of elastic steel balls 132 (similar to The elastic steel ball used on the bearing) to realize the translation of the moving track 13 along the transverse track 11, such as figure 2 shown. In other embodiments, the connection between the moving track and the ...

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Abstract

The invention discloses an automatic moving track structure and a moving system. The track structure comprises a plurality of transverse tracks and a plurality of longitudinal tracks, the longitudinal tracks comprise a plurality of moving tracks of which the two ends are connected to the transverse tracks and which move along the transverse tracks. With the arrangement of the moving tracks, the track structure can be moved above an adjacent machine stacked part and can even be moved to the position of any machine stacked part in a transverse direction according to requirement, track number is greatly reduced, and the track structure is simpler than that of prior art; load at the top of system space such as ceiling is further substantially reduced, and safety and moving efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit material conveying equipment, in particular to a track structure and an automatic conveying system in a silicon wafer box automatic conveying system. Background technique [0002] With the development of semiconductor technology, 300mm silicon wafers have gradually replaced 200mm silicon wafers and become the mainstream, and the weight of each silicon wafer box loaded with silicon wafers has also changed from about 4 kg to about 9 kg. Therefore, manual transport is still carried by manpower, which not only reduces efficiency, but also has the possibility of personal injury of the transporter. At the same time, semiconductor manufacturing has increasingly stringent requirements on plant utilization and production cycle, and the importance of Automated Material Handling Systems (AMHS) as a link to transport silicon wafers between various manufacturing modules is also increas...

Claims

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Application Information

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IPC IPC(8): B65G49/07
Inventor 计军
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT