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Joint module

A technology of modules and snap-fit ​​components, applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve problems such as deformation and warping, insufficient strength of joints, and inaccurate alignment of the two shells, so as to achieve convenient operation, The effect of increasing joint strength

Active Publication Date: 2014-04-16
ACER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the light and thin and multiple designs are combined, the new problem encountered is that the two shells cannot be aligned accurately when they are horizontally docked, and due to the insufficient strength of the connection, deformation and warping are prone to occur

Method used

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Embodiment Construction

[0057] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

[0058] Figure 1A It is a schematic diagram of an assembled joint module according to an embodiment of the present invention. see Figure 1A , the bonding module 100 of this embodiment includes a first housing 110 and a second housing 120 . In this embodiment, the first housing 110 can be an expansion base, and the first housing 110 includes a first connection port 116 a and an input and output port 116 b. The input and output ports 116b are electrically connected to the first connection port 116a, and can be used for users to insert an external device (not shown). The second housing 120 can be an expansion module, such as a keyboard module, a tablet, or an audio-visual module (such as a speaker, etc.).

[0059] The second casing 120 includes a second connect...

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PUM

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Abstract

The invention relates to a joint module which comprises a first shell and a second shell. The first shell comprises a first body, a containing groove, a track and a pushing part. The track is communicated with the containing groove, and the axial depth of the track is greater than the axial depth of the containing groove. The pushing part is fixed in the containing groove. The second shell comprises a second body, a linkage part, a connection rod and a joint arm. The connection rod is connected to the second body in a pivoted mode and comprises a first end and a second end opposite to the first end. The first end of the connection rod is connected to the linkage part in a pivoted mode, and the second end of the connection rod is connected to the joint arm in a pivoted mode. When part of the second shell stretches into the containing groove of the first shell in the axial direction, the pushing part of the first shell pushes the linkage part, and the connection rod rotates correspondingly so as to drive the joint arm to stretch in the track of the first shell. The joint module is convenient to operate, and stiffness and strength of the joint of the two shells which are in butt joint can be improved effectively.

Description

technical field [0001] The invention relates to a bonding module, and in particular to a bonding module with better bonding strength. Background technique [0002] At present, consumer electronic products tend to be designed in a thinner and more diverse direction. In terms of thin and light design, the thickness and size of the internal electronic components, mechanism structure and shell are usually reduced to reduce the appearance thickness of the product. However, the subsequent problem is that when the thickness of the product is reduced, its overall structural rigidity will also decline, which not only affects the reliability of the product, but also reduces the strength and life of the product. [0003] A common solution is to replace the plastic material with metal or carbon fiber for the structure or shell of the product to increase rigidity. However, replacement materials must face problems such as increased cost, increased weight, and blocked antenna reception. ...

Claims

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Application Information

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IPC IPC(8): H05K5/00H05K7/14G06F1/16
Inventor 黄昱诚吴圣文庄少棋
Owner ACER INC
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