Automatic production line for continuous electroplating of ultrafine metal wire

Abstract

The invention relates to the technical field of electroplating equipment, and in particular relates to an automatic production line for continuous electroplating of an ultrafine metal wire, which is used for a solution of equipment for electroplating a surface layer of an ultrafine metal wire with other metal plating layers in the electroplating industry. A brand new unwinding mechanism is adopted for performing constant-tension unwinding, so that the tension of the metal wire during the unwinding keeps constant; by virtue of a brand new driving mechanism, the linear speed keeps constant when the metal wire moves in the production line and can be adjusted as required so as to meet requirements of an electroplating process; a winding mechanism can be used for performing constant-torque winding during winding, and the winding torque can be adjusted according to the thickness of the metal wire; by virtue of the brand new winding mechanism, the wire can be accurately arranged according to the winding speed, so that the metal wire can be smoothly and attractively arranged; a buffer mechanism is additionally arranged between the driving mechanism and the winding mechanism, and can be used for balancing the speed difference between the driving mechanism and the winding mechanism.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to an automatic production line for continuous electroplating of ultra-fine metal wires used in the electroplating industry to electroplate other metal coating equipment on the surface of ultra-fine metal wires. Background technique [0002] With the rapid development of the modern electronics industry, the volume of electronic components has been reduced exponentially, which requires the raw materials for the production of electronic components to be more delicate and compact, even difficult to observe with the naked eye. Surface-treated thin copper wires are often used in the electronics industry, and electroplating other metal coatings on the surface of fine copper wires is a frequently used process. The minimum diameter of the thin copper wire is less than 0.02 mm, which is only one-third of the hair. Because the copper wire is too thin, it is easily broken dur...

AI Technical Summary

Problems solved by technology

Because the copper wire is too thin, it is easily broken during production

Especially in the continuous electroplating process, in order to improve the efficiency of electroplating production, the length of the production line reaches tens of meters, and the thin copper wire is easily broken when passing through the tens of meters long production line at high speed, which makes it difficult to carry out electroplating production efficiently. Difficult to guarantee quality

At the same time, because the copper wire is too thin, it is difficult to solve the problems of conducting electricity during the electroplating process, winding and arranging wires, etc.

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