Insulation board used for overcoming thermal bridge effect of wall

A technology of thermal insulation board and thermal bridge, applied in thermal insulation, building components and other directions, can solve the problem of unusable wall joints

Inactive Publication Date: 2014-04-23
杨永福 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of insulation board can only be used for flat wal

Method used

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  • Insulation board used for overcoming thermal bridge effect of wall
  • Insulation board used for overcoming thermal bridge effect of wall
  • Insulation board used for overcoming thermal bridge effect of wall

Examples

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Embodiment Construction

[0017] The following are examples, but the contents of the present invention are not limited to the scope of these examples.

[0018] Such as Figure 2a , Figure 2b , Figure 3a , Figure 3b As shown, the two-dimensional right-angled structure 2 and the three-dimensional right-angled structure 3 formed integrally by the insulation board of the present invention both include a panel 4 and a bottom plate 5, and the shape of the panel 4 and the bottom plate 5 are the same and equal in thickness; the two-dimensional right-angled insulation board The panel 4 of 2 is equal to the size of the bottom plate 5, and is arranged in a dislocation to form a convex first lap 6 at the edge; the panel 4 of the three-dimensional right-angled insulation board 3 is smaller than the bottom plate 5 to form a convex first at the edge. Two overlapping parts 7 , the first overlapping part 6 and the second overlapping part 7 can cooperate with each other. The thermal insulation board of the presen...

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PUM

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Abstract

The invention relates to an insulation board used for overcoming the thermal bridge effect of a wall. The insulation board comprises a face plate and a substrate, wherein the face plate and the substrate are identical in shape and equal in thickness, and the insulation board is either a two-dimensional perpendicular structure or a three-dimensional perpendicular structure which is integrally formed by the face plate and the substrate; the face plate and substrate of a two-dimensional perpendicular insulation board are equal in dimension, and are alternately arranged to form a convex first splicing part at the edge of the two-dimensional perpendicular insulation board; the face plate of the three-dimensional perpendicular insulation board is less than the substrate so as to form a convex second splicing part at the edge of the three-dimensional perpendicular insulation board, and the first splicing part and the second splicing part are matched with each other. The two-dimensional perpendicular insulation board, the three-dimensional perpendicular insulation board and a flat insulation board with a convex splicing edge are mutually matched to be used for inner and outer walls, and a heat dam can be built on a heat transfer channel to cut off a thermal bridge, so that the thermal bridge effect can be eliminated.

Description

technical field [0001] The invention relates to a thermal insulation board, in particular to a thermal insulation board capable of overcoming the thermal bridge effect of a wall. Background technique [0002] In the building enclosure structure, the heat transfer coefficient between doors, windows, lintels, ring beams, reinforced concrete anti-seismic columns, reinforced concrete shear walls, beams, columns and other parts and the joints of the wall is much greater than that of the main part. The thermal coefficient forms a dense heat flow channel, which is named as a thermal bridge in architecture. The thermal bridge effect produced by the thermal bridge has a destructive effect on the building. In the season when there is a temperature difference between indoor and outdoor in late autumn and early winter, especially in cold winter, a large amount of indoor heat energy can dissipate outward through the weak link of the thermal bridge, and due to The temperature of the ther...

Claims

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Application Information

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IPC IPC(8): E04B1/80
Inventor 杨永福
Owner 杨永福
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