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Insulation board used for overcoming thermal bridge effect of wall

A technology of thermal insulation board and thermal bridge, applied in thermal insulation, building components and other directions, can solve the problem of unusable wall joints

Inactive Publication Date: 2014-04-23
杨永福 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of insulation board can only be used for flat walls, and cannot be used for wall junctions with thermal bridge effects

Method used

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  • Insulation board used for overcoming thermal bridge effect of wall
  • Insulation board used for overcoming thermal bridge effect of wall
  • Insulation board used for overcoming thermal bridge effect of wall

Examples

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Embodiment Construction

[0017] The following are examples, but the contents of the present invention are not limited to the scope of these examples.

[0018] Such as Figure 2a , Figure 2b , Figure 3a , Figure 3b As shown, the two-dimensional right-angled structure 2 and the three-dimensional right-angled structure 3 formed integrally by the insulation board of the present invention both include a panel 4 and a bottom plate 5, and the shape of the panel 4 and the bottom plate 5 are the same and equal in thickness; the two-dimensional right-angled insulation board The panel 4 of 2 is equal to the size of the bottom plate 5, and is arranged in a dislocation to form a convex first lap 6 at the edge; the panel 4 of the three-dimensional right-angled insulation board 3 is smaller than the bottom plate 5 to form a convex first at the edge. Two overlapping parts 7 , the first overlapping part 6 and the second overlapping part 7 can cooperate with each other. The thermal insulation board of the presen...

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Abstract

The invention relates to an insulation board used for overcoming the thermal bridge effect of a wall. The insulation board comprises a face plate and a substrate, wherein the face plate and the substrate are identical in shape and equal in thickness, and the insulation board is either a two-dimensional perpendicular structure or a three-dimensional perpendicular structure which is integrally formed by the face plate and the substrate; the face plate and substrate of a two-dimensional perpendicular insulation board are equal in dimension, and are alternately arranged to form a convex first splicing part at the edge of the two-dimensional perpendicular insulation board; the face plate of the three-dimensional perpendicular insulation board is less than the substrate so as to form a convex second splicing part at the edge of the three-dimensional perpendicular insulation board, and the first splicing part and the second splicing part are matched with each other. The two-dimensional perpendicular insulation board, the three-dimensional perpendicular insulation board and a flat insulation board with a convex splicing edge are mutually matched to be used for inner and outer walls, and a heat dam can be built on a heat transfer channel to cut off a thermal bridge, so that the thermal bridge effect can be eliminated.

Description

technical field [0001] The invention relates to a thermal insulation board, in particular to a thermal insulation board capable of overcoming the thermal bridge effect of a wall. Background technique [0002] In the building enclosure structure, the heat transfer coefficient between doors, windows, lintels, ring beams, reinforced concrete anti-seismic columns, reinforced concrete shear walls, beams, columns and other parts and the joints of the wall is much greater than that of the main part. The thermal coefficient forms a dense heat flow channel, which is named as a thermal bridge in architecture. The thermal bridge effect produced by the thermal bridge has a destructive effect on the building. In the season when there is a temperature difference between indoor and outdoor in late autumn and early winter, especially in cold winter, a large amount of indoor heat energy can dissipate outward through the weak link of the thermal bridge, and due to The temperature of the ther...

Claims

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Application Information

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IPC IPC(8): E04B1/80
Inventor 杨永福
Owner 杨永福
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