An emc packaging device for led bracket

Abstract

The invention discloses an EMC (Electro-Magnetic Compatibility) packaging device for an LED (Light-Emitting Diode) support. The EMC packaging device comprises a central material supply body (1) and a packaging body (3), wherein two sub-runners (2) are arranged on two ends of the central material supply body (1), sprues (5) are formed in the ends of the sub-runners (2), the packaging body (3) is connected with a wide-opened auxiliary sprue (4) opposite to the sprues (5) which are connected with the packaging body (3) through the auxiliary sprue (4), the depth of the sprues (5) is greater than the height of the packaging body (3), and the height of the packaging body (3) is greater than that of the auxiliary sprue (4). According to the EMC packaging device for LED support, by adopting the structural design of combining the packaging body, the sprues and the wide-opened sprue, epoxy resin can evenly and slowly fill the packaging body with large area through the auxiliary sprue, the bad problems of the not enough filling, loosing and the like in the EMC packaging process can be decreased, and the percent rate of the product can be improved.

Description

technical field [0001] The invention relates to an EMC packaging device for an LED bracket. Background technique [0002] Under the background of low-carbon economy, energy saving and environmental protection, my country's LED industry is developing rapidly, and the development prospects of the LED industry are very promising. EMC packaging is one of the current high-end development directions of the LED industry. Since the plastic packaging material used in EMC bracket packaging is epoxy resin, this material has the advantages of UV resistance, good stability under high temperature conditions, and low expansion coefficient. In terms of production capacity, EMC packaging is also far greater than the traditional use of PPA plastics. Packaged LED products, and EMC packaged equipment occupies a small area, the availability of equipment is high, and the secondary investment is small when developing new products. EMC packaging has been developed for a long time in Europe, America...

AI Technical Summary

Problems solved by technology

EMC packaging has the characteristics of high density, high integration, and ultra-thin packaging products. This feature of EMC packaging determines the compact structure of its mold. Each fixed core on the mold is the cup mouth of a product, and two phases The distance between the adjacent cores is very small, and the existing single gate design is difficult to fill the position on the back of the core tightly when filling the epoxy resin. In the process of packaging, looseness often occurs, the filling is not enough, and residues remain after the runners are separated. Large, affecting the subsequent cutting and other issues, reducing the product qualification rate of EMC packaging

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