Process chamber air distribution adjustment-oriented chemical vapor deposition (CVD) equipment spray header

Abstract

The invention relates to the field of chemical vapor deposition equipment, and particularly relates to a process chamber air distribution adjustment-oriented chemical vapor deposition (CVD) equipment spray header. A plurality of step spray holes are formed on the spray header; each spray hole is formed by a round hole with a larger diameter at the upper part and a round hole with a smaller diameter at the lower part; one or more parameters of the step depth, the large hole aperture and the small hole aperture are gradually increased from the center of the board of the spray header to the edge, so that gradual reduction of impedance on a board of the spray header from the center to the edge is achieved, the expected air circulation is gradually increased, and adjustment of impedance distribution on the board of the spray header is achieved. Thus, air distribution adjustment inside the process chamber is achieved. The process chamber air distribution adjustment-oriented CVD equipment spray header is cheap in design scheme, and high in efficiency, and fine adjustment of air distribution inside the process chamber is achieved just by continuous design on the small hole configuration of the spray header. Thus, fine adjustment of process and quality distribution is achieved.

Description

technical field [0001] The invention relates to the field of chemical vapor deposition (CVD) equipment, in particular to a CVD equipment spray head for adjusting the gas flow distribution of a process chamber. Background technique [0002] Chemical vapor deposition (CVD) is a process technology in which reactant substances react chemically under gaseous conditions to generate solid substances and deposit them on the surface of a heated solid substrate to obtain solid materials. It is realized by chemical vapor deposition devices. At present, chemical vapor deposition (CVD) equipment, such as plasma enhanced chemical vapor deposition (PECVD) equipment, low pressure chemical vapor deposition (LPCVD) equipment, metal organic compound chemical vapor deposition (MOCVD) equipment has been widely used in the field of semiconductor device manufacturing. The chemical vapor deposition equipment in the prior art is briefly described below by taking ion-enhanced chemical vapor depositio...

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Problems solved by technology

[0005] The CVD process is a typical multi-physics coupling process, in which material transport has an extremely important impact on process performance, and the shower head gas distribution system is the most important component for regulating material transport in the process chamber, among which the shower head Thousands of small holes are arranged on the plate surface, and the existing sprinkler head air distribution system design, the small holes on the plate surface are generally uniformly arranged, and the flexible adjustment of the airflow distribution in the process chamber has not been brought into play. Potential, therefore, when there is a deviation in the thin film deposition process, some relatively rigid means are often used, such as increasing or reducing certain components or their structural dimensions. This discontinuous uniform design scheme is useful for correcting process deviations with continuous distribution It is very difficult, the degree of improvement of process performance is very limited, and the modification of equipment is often relatively large

However, if considering the continuous non-uniform design of the small hole structure or layout on the surface of the sprinkler head to correct the process deviation, it will have very high adjustment accuracy and flexibility, and there will be no changes to other parts of the equipment

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