Heat dissipation device for portable type electronic device
A technology for electronic devices and heat sinks, applied in electrical components, structural parts of electrical equipment, cooling/ventilation/heating renovation, etc. Heat dissipation efficiency, effect of preventing heat accumulation
Inactive Publication Date: 2014-05-14
DONG GUAN HAN XU HARDWARE & PLASTIC TECH CO LTD
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- Application Information
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Problems solved by technology
[0004] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a heat sink for portable electronic devices, which can effectively solve the problem that the cooling efficiency of heat sinks for existing portable electronic devices is quite slow
Method used
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Embodiment Construction
[0038] Please refer to Figure 1 to Figure 5 As shown, it is the first embodiment of the heat dissipation device of the portable electronic device according to the present invention, which mainly includes a combination of a thin metal plate 1 and more than one heat pipe 2, and wherein:
[0039] sheet metal 1 such as figure 1 , it selects a metal plate with better heat conduction effect, and stamps and forms more than one sinking groove 11 on the thin metal plate 1 integrally, and forms a boss portion 111 on one or both sides of the sinking groove 11, and The sinking groove 11 is adapted to the shape of the corresponding heat pipe 2;
[0040] The heat pipe 2 is flat and thin, and matches the sinking groove 11 embedded in the metal sheet 1 (such as figure 2 );
[0041] With the above-mentioned thin metal plate 1 and the heat pipe 2, after the heat pipe 2 is adapted and embedded in the sink groove 11, pressure deformation is applied to the bosses 111 on one side or both sides...
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The invention discloses a heat dissipation device for a portable type electronic device. The heat dissipation device is formed by combining sheet metal and more than one heat conduction pipe. The sheet metal is formed integrally in a punching mode and is provided with more than one sunken groove, boss portions are formed on one side or two sides of the sunken groove, the sunken groove is of a shape corresponding to that of the heat conduction pipe so that the heat conduction pipe can be embedded into the sunken groove in a matching mode, then pressure is exerted on the boss portions of the sunken groove, so that the boss portions are deformed, and the deformed boss portions can fill and coat the heat conduction pipe to form close combination. Through attachment contact of the heat conduction pipe and a heating assembly, heat can be transmitted to the sheet metal fast, heat dissipation can be finished fast, accumulation of the heat is prevented effectively, the heat dissipation efficiency is improved, and the phenomenon that the portable type electronic device crashes or the assembly is damaged can be avoided.
Description
technical field [0001] The invention relates to a heat dissipation device, especially a heat dissipation device of a portable electronic device, which is composed of a thin metal plate and more than one heat pipe. Background technique [0002] Various known portable electronic devices, such as mobile phones, laptops, tablet computers, iPads, PDAs, GPS and other portable electronic devices, have become thinner and lighter in size and appearance due to the rapid advancement of technology, but the computing functions However, it is getting stronger and stronger, so that its internal central processing unit (CPU) and integrated circuit (IC) and other components will generate quite high heat during operation, so it is necessary to try to eliminate the high heat in order to ensure the normal operation of the heating component, and Maintain service life. [0003] Conventional heat sinks for portable electronic devices are limited by their flat, thin and lightweight features. There...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20445H05K7/20254H05K7/20627
Inventor 黄崇贤
Owner DONG GUAN HAN XU HARDWARE & PLASTIC TECH CO LTD