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Direct motion mechanism for electronic component mounting equipment

A technology of electronic component installation and direct motion mechanism, which is applied in the direction of electrical components, feeding devices, electrical components, etc., can solve the problems of processing cost and processing technology that are difficult to achieve processing accuracy, and it is difficult to ensure the parallelism of the direct motion guide part, so as to ensure the vertical Effects of straightness and parallelism, suppression of oversizing, and accuracy assurance

Active Publication Date: 2018-01-30
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, in the linear motion mechanism that requires high-speed movement, it is difficult to achieve the required processing accuracy in terms of processing cost and processing technology.
In addition, it is difficult to ensure the parallelism of the plurality of linear motion guides on the orthogonal surface.

Method used

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  • Direct motion mechanism for electronic component mounting equipment
  • Direct motion mechanism for electronic component mounting equipment
  • Direct motion mechanism for electronic component mounting equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0086] Next, the Y linear motion mechanism part 62 provided with the linear motion mechanism 10 which concerns on this embodiment is demonstrated. figure 2 is a schematic plan view of the linear motion mechanism according to the present embodiment, image 3 It is a schematic front view of the linear motion mechanism concerning this embodiment.

[0087] As mentioned above, the Y linear motion mechanism part 62 has the linear motion mechanism 10 in this embodiment. The linear motion mechanisms 10 are respectively disposed on both end sides of the X-axis guide rails 61 a of the X linear motion mechanism portion 61 as a driven body. In addition, the linear motion mechanism 10 includes a frame 11 , a base 12 , a linear motor 13 , a linear motion guide 14 , and an auxiliary guide 15 .

[0088] The frame 11 is fixed to the main body 2 a of the frame body 2 in the electronic component mounting apparatus 1 . The frame 11 is provided upright on the upper surface of the main body 2a,...

Embodiment approach 2

[0110] Next, the Y linear motion mechanism part 62 provided with the linear motion mechanism 10 which concerns on this embodiment is demonstrated. Image 6 is a schematic plan view of the linear motion mechanism according to the present embodiment, Figure 7 It is a schematic front view of the linear motion mechanism concerning this embodiment.

[0111] In addition, the linear motion mechanism of this embodiment differs from the linear motion mechanism of Embodiment 1 mentioned above in the structure of an auxiliary guide part and a movable part, and other structures are the same. Therefore, in the following, the same reference numerals are attached to the same parts as those in Embodiment 1, and description thereof will be omitted.

[0112] The auxiliary guide part 15 has a guide rail 15d and a slider (moving part) 15e. The guide rail 15d is attached to the fixing member 18 fixed to the vertical surface 11a in the frame 11 below the linear motor 13 . The cross section of t...

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Abstract

The present invention provides a linear motion mechanism for an electronic component mounting device that suppresses enlargement of the device and ensures verticality and parallelism of a linear motion guide. It is arranged on both sides of the driven body, including: a fixed frame; a base; a linear motor; a linear guide, which is composed of a sliding guide rail and a slider, and the sliding guide rail is installed above the linear motor with the upper part of the frame facing upwards. On the horizontal plane, the slider is installed on the downward horizontal plane in the base, and moves along the sliding guide rail; the auxiliary guide part, which is composed of guide rails and rollers, is installed below the linear motor and on the vertical plane of the frame, Extending in the same direction as the sliding guide rail, the roller is installed on the vertical surface of the base, contacts the guide rail in the opposite direction of the moving part and the fixed part of the linear motor, and rolls along the guide rail; and the movable part, which maintains a straight The fitting of the movable guide part and the engagement of the auxiliary guide part allow the vertical displacement of the base.

Description

technical field [0001] The present invention relates to a linear motion mechanism for moving a mounting head for mounting electronic components on a substrate in an electronic component mounting apparatus. Background technique [0002] Generally, an electronic component mounting apparatus for mounting an electronic component on a substrate has a mounting head provided with a suction nozzle, holds the electronic component with the suction nozzle, and mounts the electronic component on the substrate. The electronic component mounting apparatus has a moving unit that moves the mounting head in a direction parallel to the surface of the substrate. The moving part is composed of the following parts: a first direct motion mechanism part that linearly moves the mounting head in a first direction (Y direction) parallel to the surface of the substrate; and a second direct motion mechanism part that moves the mounting head It moves linearly in a second direction (X direction) paralle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04B23Q5/28
Inventor 野原伸和
Owner JUKI CORP