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Sputtering apparatus and method

A sputtering device, sputtering target technology, applied in sputtering coating, ion implantation coating, coating and other directions, can solve problems such as large substrate area

Active Publication Date: 2014-06-11
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Maintaining thickness uniformity across the length and width of thin-film solar panels is a challenge due to the large substrate area occupied by solar panels

Method used

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  • Sputtering apparatus and method
  • Sputtering apparatus and method
  • Sputtering apparatus and method

Examples

Experimental program
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Embodiment Construction

[0046] The description of the exemplary embodiments should be read in conjunction with the accompanying drawings, which are also considered an integral part of this specification. In the specification, relative terms such as "lower", "higher", "horizontal", "vertical", "above", "between Below", "upward", "downward", "top" and "bottom" and their derivatives (for example, "horizontally", "downwardly", "upwardly", etc.) The orientation described or shown in the figure. These relative terms are for convenience of description and the device does not necessarily need to be constructed or operated in a particular orientation. Unless otherwise stated, terms such as "connected" and "interconnected", attached, connected, etc., refer to a relationship in which a structure is fixed or connected to another structure, directly or indirectly through intervening structures, as well as a removable or rigid connection or relationship .

[0047] The methods and apparatus described herein impr...

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Abstract

A sputtering apparatus disclosed in the invention comprises a chamber configured to contain at least one sputter target and at least one substrate to be coated. The chamber has at least one adjustable shielding member defining an adjustable aperture. The member is positioned between the at least one sputter target and the at least one substrate. The aperture is adjustable in at least one of the group consisting of area and shape. A sputtering method is also disclosed.

Description

technical field [0001] The invention relates to a sputtering device and a method for depositing thin films. Background technique [0002] Sputtering is a physical vapor deposition (PVD) method that deposits thin films by ejecting material from a target (ie source). This material is then deposited onto a "substrate," such as a semiconductor wafer. [0003] Sputtering sources use strong electric and magnetic fields to trap electrons near the target surface. The electrons take a helical path around the magnetic field lines and collide with the target surface, transferring kinetic energy to the particles ejected from the targeted substrate. Sputtering can be performed at a temperature lower than the melting temperature of the target material. [0004] Sputtering has been considered for the fabrication of thin-film photovoltaic solar cells. Maintaining thickness uniformity across the length and width of a thin film solar panel is challenging due to the large substrate area oc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
CPCC23C14/34C23C14/086C23C14/3407C23C14/3492C23C14/56H01J37/32651
Inventor 严文材吴忠宪陈世伟吴英信薛瑞福陈冠竹
Owner TAIWAN SEMICON MFG CO LTD