Substrate peeling device, peeling method, and electronic device manufacturing method
A technology for peeling off devices and substrates, which can be used in semiconductor/solid-state device manufacturing, electrical solid-state devices, electrical components, etc., and can solve problems such as surface difficulties and substrate handling deterioration.
Active Publication Date: 2017-04-12
AGC INC
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Problems solved by technology
However, when the strength of the substrate decreases due to thinning, the handling of the substrate deteriorates, so functional layers for electronic devices such as thin film transistors (TFT: Thin Film Transistor) and color filters (CF: color filter) are formed on The surface of the substrate becomes difficult
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[0051] Hereinafter, embodiments of a substrate peeling device, a peeling method, and an electronic device manufacturing method according to the present invention will be described with reference to the drawings.
[0052] figure 1 It is an enlarged side view of main parts of the laminated board 1 used in the manufacturing process of an electronic device.
[0053] (Manufacturing method of electronic device)
[0054] In order to cope with the thinning of the substrate 2 used in electronic devices, the manufacturing method of the electronic device according to the embodiment has the following steps: constructing the laminated board 1 in which the reinforcing plate 3 is pasted on the back surface of the substrate 2 , 2, a functional layer forming step of forming a functional layer on the surface of 2; and a peeling step of peeling between the substrate 2 on which the functional layer is formed and the reinforcing plate 3. In the above peeling step, the substrate peeling device a...
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Abstract
The invention relates to a device for peeling a substrate, a method for peeling a substrate and a method for producing an electronic device. The device for peeling the substrate is used for sequentially peeling an interface between the substrate and a reinforcing plate reinforcing the substrate along a peeling direction from one end side to the other end side. The device for peeling the substrate is characterized in that the device comprises a peeling member; and when an angle formed between a straight line connected by two intersected points between the boundary of a peeled area and an unpeeled area of the interface and the outer periphery of the substrate is within a peeling range of at least below 90 degrees, the peeling member peels the interface in such a manner that an angle formed between a tangent line at the end portion of the boundary and a tangent line of the outer periphery of the substrate in the peeled area is greater than 90 degrees.
Description
technical field [0001] The present invention relates to a substrate peeling device and a peeling method for peeling an interface between a substrate and a reinforcing plate, and a manufacturing method of an electronic device. Background technique [0002] In recent years, along with the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin-film secondary batteries, there has been a demand for thinner substrates used in electronic devices. However, when the strength of the substrate decreases due to thinning, the handling of the substrate deteriorates, so functional layers for electronic devices such as thin film transistors (TFT: Thin Film Transistor) and color filters (CF: color filter) are formed on The surface of the substrate becomes difficult. [0003] Therefore, a method has been proposed in which a laminate (in a broad sense, a laminate) in which a reinforcing plate is bonded to the back of the substrate in a detachable...
Claims
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IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68386B29C63/0013B65H29/56B65H2301/51122
Inventor 伊藤泰则宇津木洋泷内圭
Owner AGC INC