Heat radiating device of power device

A technology of power devices and heat sinks, applied in the field of communication, can solve problems such as poor insulation, high brittleness, and difficult to find cracks, and achieve the effect of improving heat dissipation

Inactive Publication Date: 2014-06-18
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the high brittleness of the ceramic substrate itself, the requirements for the flatness of the radiator, the flatness of the ceramic substrate itself, and the size of the torque during assembly are very high. It is difficult to find cra

Method used

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  • Heat radiating device of power device
  • Heat radiating device of power device
  • Heat radiating device of power device

Examples

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[0025] Hereinafter, the present invention will be described in detail with reference to the drawings and in conjunction with the embodiments. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other if there is no conflict.

[0026] figure 2 It is a schematic structural diagram of a heat dissipation device for a power device according to an embodiment of the present invention, such as figure 2 As shown, the heat dissipation device of the power device includes: a power device 21, a heat sink device 22, and a thermally conductive insulation device 23 connected between the power device and the heat sink device, wherein the thermally conductive insulation device 23 is connected to the power device 21 and the heat sink device 22 They are all connected by welding or bonding, and 23 thermal insulators are ceramic composite metal substrates.

[0027] In this embodiment, the heat sink 22 is a heat dissipation substrate...

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Abstract

The invention discloses a heat radiating device of a power device. The heat radiating device of the power device comprises the power device, a heat radiating device and a thermally conductive and insulating device connected between the power device and the radiating device, wherein the thermally conductive and insulating device is connected with the power device as well as the radiating device by welding or adhering; the thermally conductive and insulating device is a ceramic composite metal substrate. Through the heat radiating device of the power device, the effects of improving the heat radiating capacity of the power device and the power density of a product can be achieved, and the strong market demands on high efficiency and high power density of a power supply are met.

Description

technical field [0001] The invention relates to the communication field, in particular to a heat dissipation device for a power device. Background technique [0002] With the development of technology, more and more equipment is developing towards miniaturization and integration, and all corresponding devices are developing towards integration and miniaturization. The power density of products is getting higher and higher. For high power density , the heat dissipation and insulation problems of power devices need to be solved urgently. [0003] As an important power device of the product, the power tube is the main heat-generating device in the product. Generally, the power device needs to be attached to the heat sink through the installation method to conduct the heat. The current power device and the heat sink There are several ways to install the room: [0004] Please refer to figure 1 , figure 1 It is a schematic diagram of installation between a power device and a h...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373
Inventor 崔万恒陈丽霞黄柱
Owner ZTE CORP
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