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Heat dissipation fin, heat dissipation fin assembly and electronic device

A heat dissipation fin group and heat dissipation fin technology are applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., which can solve the problems that cannot be prepared at the same time, and achieve the effect of increasing heat dissipation efficiency and improving heat transfer effect

Inactive Publication Date: 2014-06-25
CELESTICA TECH CONSULTANCY SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

From this point of view, prior art can only be optimized for one of the surface contact performance or its flow rate, but cannot combine the advantages of both

Method used

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  • Heat dissipation fin, heat dissipation fin assembly and electronic device
  • Heat dissipation fin, heat dissipation fin assembly and electronic device
  • Heat dissipation fin, heat dissipation fin assembly and electronic device

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Embodiment Construction

[0036] The invention provides a cooling fin, a cooling fin group and an electronic device. More specifically, the present invention proposes an electronic device, and the electronic system includes a cooling fin set, and the cooling fin set includes the aforementioned cooling fins. The heat dissipation fins, heat dissipation fin group and an electronic device of the present invention can be applied to the internal heat dissipation of electronic components such as computers or servers. Compared with the known technology that increases the contact surface area and makes the perforation generate turbulent flow and thus reduce the flow velocity, the present invention aims to solve the problem that the increase of the contact surface area and the turbulence decrease the flow velocity cannot be solved at the same time.

[0037] Please also refer to figure 1 and figure 2 , figure 1 It is a schematic diagram depicting an electronic device of the present invention in a specific emb...

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Abstract

The invention discloses a heat dissipation fin, a heat dissipation fin assembly and an electronic device. The heat dissipation fin comprises a first side surface and a corresponding second side surface. At least one second deformation region is arranged on the second side surface, and a protruded structure is formed in each second deformation region and is outwardly protruded from the second side surface towards a normal vector direction of the second side surface. Compared with a perforated heat dissipation fin in the prior art, the heat dissipation fin, the heat dissipation fin assembly and the electronic device have the advantages that the heat dissipation fin and the heat dissipation fin assembly can be applied to dissipating heat inside electronic elements such as a computer or a server, and the long-term problem of low heat dissipation efficiency in the technical field can be solved by the aid of the heat dissipation fin without perforated holes and extensive application of the heat dissipation fin.

Description

technical field [0001] The invention discloses a heat dissipation fin, a heat dissipation fin group and an electronic device. More specifically, the invention discloses an electronic device which includes a heat dissipation device including a plurality of heat dissipation fins designed for high-efficiency heat dissipation Fin set. Background technique [0002] Due to the increasing demand for cloud servers, server computing performance and hardware configuration density have increased relatively, and server design with one or more high-performance processors (135W or above) is also market-oriented and design-oriented. However, when a processor is used in a 1U server, the heat dissipation of the processor is also an independent issue due to its difficulty. Due to the space limitation of the 1U server, the design of the wide surface of the processor cooling fins is limited by the placement of memory and other components, so it is impossible to use large-area cooling fins for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 苏绍宇黄仁杰
Owner CELESTICA TECH CONSULTANCY SHANGHAI