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resin composition

A technology of resin composition and epoxy resin, which is applied in the direction of epoxy resin coating, synthetic resin layered products, coating, etc., can solve the problems that the performance is not necessarily satisfied, and achieve the effect of small root mean square roughness

Active Publication Date: 2016-05-18
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its performance is not necessarily satisfied

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0130] The preparation method of the resin composition of this invention is not specifically limited, For example, the method of adding a solvent etc. as needed to a compounding component, and using a rotary mixer etc. is mentioned, etc. are mentioned.

[0131] The use of the resin composition of the present invention is not particularly limited, and it can be used in a wide range of applications that require a resin composition as follows: sheet-like laminates such as adhesive films, prepregs, circuit boards (laminates, poly multilayer printed wiring board, etc.), solder resist, underfill material (anda fil material), die bonding material, semiconductor sealing material, hole filling resin (cavity embedding resin), component packaging resin, etc. (part embedding resin). Among them, in the manufacture of a multilayer printed wiring board, it can be preferably used as a resin composition for forming an insulating layer, and can be more preferably used as a resin composition for ...

Embodiment

[0176] Hereinafter, the present invention will be described more specifically using examples, but the present invention is not limited by these examples.

[0177]

[0178] First, various measurement methods and evaluation methods will be described.

[0179]

[0180] (1) Substrate treatment of inner layer circuit board

[0181] Both sides of a glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.3 mm, Matsushita Electric Works Co., Ltd. Make CZ8100 and etch 1μm to roughen the copper surface.

[0182] (2) Lamination of adhesive film

[0183] The adhesive films produced in Examples and Comparative Examples were laminated on both sides of the inner layer circuit board using a batch type vacuum pressure laminator MVLP-500 (trade name manufactured by Meiki Co., Ltd.). Lamination was performed by decompressing for 30 seconds until the air pressure became 13 hPa or less, and then pressurizing at 100° C. and a pressur...

Embodiment 2

[0225] Resin varnishes were prepared in the same manner except that the manufactured product 1 of Example 1 was changed to manufactured product 2. Next, using this resin varnish, it carried out exactly the same as Example 1, and obtained the adhesive film.

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Abstract

The present invention is a resin composition containing (A) epoxy resin, (B) curing agent, and (C) inorganic filler, characterized in that, in the resin composition, the above-mentioned inorganic filler is used Organic compounds for surface treatment. This resin composition has small arithmetic mean roughness and root mean square roughness of the surface of the insulating layer in the wet roughening process, can form a plated conductor layer having sufficient peel strength thereon, and has PCT resistance.

Description

technical field [0001] The present invention relates to resin compositions. It further relates to an adhesive film, a prepreg, a multilayer printed wiring board, and a semiconductor device containing the resin composition. Background technique [0002] In recent years, miniaturization and high performance of electronic devices have progressed. In multilayer printed wiring boards, buildup layers are multi-layered, and miniaturization and high-density wiring are required. [0003] Various efforts have been made to this end. For example, Patent Document 1 discloses a resin composition containing a silicone alkoxy oligomer. It is described that the insulating material formed from these compositions can be provided with adhesiveness. In addition, in Patent Documents 2 to 4, general compounding studies have been conducted. However, its performance is not necessarily satisfied. [0004] prior art literature [0005] patent documents [0006] [Patent Document 1] Japanese Pate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00B32B27/38C08K3/00C08K5/00H01L23/14H05K1/03
CPCH05K1/0373H05K3/4655H05K2201/0209C08J5/18C08J5/24C08J2363/00C09D163/00H01L21/568H01L2924/0002H01L2924/00C08K9/06C08L63/00
Inventor 鹤井一彦中村茂雄巽志朗
Owner AJINOMOTO CO INC