Curable composition
A composition and cured product technology, applied in polyether coatings, electrical components, circuits, etc., can solve problems such as weakened peel strength, difficulty in designing cured products, and no disclosure of curable resin compositions containing phosphonate compounds
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[0184][Preparation of composition]
[0185]The composition of the present invention can be prepared by appropriately mixing the above-mentioned ingredients and using mixing equipment such as three-roll, ball mill, bead mill, sand mill, or high-speed rotary mixer, high-speed mixer, planetary mixer, etc., as required Mix or mix to prepare. In addition, by further adding the above-mentioned organic solvent, it can also be prepared as a resin varnish.
[0186]The composition of the present invention can form a cured product capable of achieving low linear thermal expansion coefficient, low dielectric loss factor, and high glass transition temperature. Therefore, it can be suitably used as a multilayer printed wiring board in the manufacture of multilayer printed wiring boards. The composition for the insulating layer. Furthermore, it can be suitably used as a composition for stacking layers and forming a conductor layer by plating (that is, a composition for interlayer insulation).
[0187]The f...
Embodiment 1
[0247]Toluene solution of styrene-modified polyphenylene ether resin (Mitsubishi Gas Chemical Co., Ltd. "OPE-2St (number average molecular weight 1200)" non-volatile content 64.4 wt%) 125 parts, polymerization initiator (Kayaku Akzo Co., Ltd.) "Trigonox 311" manufactured by 1 part, phosphonate compound ("V-1" dimethyl vinyl phosphonate manufactured by Katayama Chemical Co., Ltd., molecular weight 130.09g / mol) 5 parts, spherical silica (average particle size) A diameter of 0.5 μm, 130 parts of "SOC4" (treated with aminophenylsilane) manufactured by Admatechs Co., Ltd. was mixed with 15 parts of MEK, and the mixture was uniformly dispersed using a high-speed rotary mixer to produce a resin varnish.
Embodiment 2
[0249]Except that the toluene solution of the styrene-modified polyphenylene ether resin was 117 parts and the phosphonate compound was 10 parts, the resin varnish was prepared in the same manner as in Example 1.
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Abstract
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