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Surface-treated copper foil and printed wiring board using the surface-treated copper foil

A surface treatment, copper foil technology, applied in printed circuit parts, metal pattern materials, layered products, etc., can solve the problem of trivalent chromium oxidation to hexavalent chromium, etc., to achieve no powder falling and maintain peel strength. Effect

Active Publication Date: 2017-06-23
FUKUKA METAL FOIL & POWDER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are problems that hexavalent chromium is contained in the treatment solution of chromate film treatment. In addition, when there is an error in the disposal method for the surface-treated copper foil formed with chromate film or due to external Environmental reasons sometimes lead to trivalent chromium being oxidized to hexavalent chromium

Method used

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  • Surface-treated copper foil and printed wiring board using the surface-treated copper foil
  • Surface-treated copper foil and printed wiring board using the surface-treated copper foil
  • Surface-treated copper foil and printed wiring board using the surface-treated copper foil

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Embodiment

[0072] Examples of the present invention are listed below, but the present invention is not limited by them.

[0073] (roughening treatment)

[0074] A rolled copper foil with a surface roughness RzJIS of 1.1 μm and a thickness of 18 μm is dipped in a mixture of 45 g / L copper sulfate pentahydrate, 100 g / L sulfuric acid, 20 ppm chloride ions, and the liquid temperature is adjusted to 30°C, and then, With platinum as the anode and at a current density of 10A / dm 2 1. Under the condition that the electrolysis time is 12 seconds, the dendritic copper powder is attached to the surface of the rolled copper foil.

[0075] In order to prevent the attached dendritic copper powder from falling off, after immersing in a mixed solution of 250g / L copper sulfate pentahydrate, 100g / L sulfuric acid, and adjusting the liquid temperature to 30°C, platinum was used as the anode and the current density was 5A / dm 2 1. Electrolyzing under the condition that the electrolysis time is 70 seconds, the...

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Abstract

The invention provides a surface treatment copper foil and a printed wiring plate using the same. The surface treatment copper foil provided can obtain normal stripping strength even though a layer containing chromium content is not formed, and can maintain the stripping strength without power falling and with long-term anti-rust property even though in a high-temperature environment, in a wet state or in a state of being soaked in drug liquid. The surface treatment copper foil is characterized in that a micro-particle layer formed by copper particles, copper-nickel particles, copper-cobalt particles, and copper-nickel-cobalt particles, a layer formed by nickel or nickel-phosphorus, and a layer formed by alkali metal silicates and silane coupling agents are successively formed on one surface of the copper foil, the particle size of the micro-particle is less than 0.3 mum, and compared with the surface area of the copper foil formed by the micro-particle layer, the surface area of the micro-particle layer increases 60-900mum2 for every 177mum2.

Description

technical field [0001] The present invention relates to a surface-treated copper foil having peel strength and long-term rust resistance even without forming a layer containing a chromium component on the surface of the copper foil, and a printed wiring board using the surface-treated copper foil. Sex and does not drop powder. Background technique [0002] For copper foil used in printed wiring boards, in addition to the peel strength that is not easy to peel off from the resin base material in a normal environment (under normal conditions), it is also required Among the various chemicals used in the manufacturing process of printed wiring boards, the peeling strength is maintained without deterioration, powder falling and etching residue are not generated, and long-lasting rust resistance is further required. [0003] In order to satisfy the above-mentioned requirements, a layer containing a chromium component is usually formed on the surface of the copper foil for printed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/02B32B15/04H05K1/09
Inventor 真锅久德城田裕美
Owner FUKUKA METAL FOIL & POWDER CO LTD
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