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98results about How to "Avoid ripple" patented technology

Primary side feedback (FB) switching power supply controller and switching power supply system

The invention relates to a primary side feedback (FB) switching power supply controller and a switching power supply system. The switching power supply system comprises a transformer, a voltage-dividing circuit, a main switch tube, an output circuit and the primary side FB switching power supply controller, wherein the voltage-dividing circuit is connected to the transformer; the power supply endof the primary side FB switching power supply controller is connected with the primary side first input end of the transformer; the FB control end of the primary side FB switching power supply controller is connected to the voltage-dividing point of the voltage-dividing circuit; the input end of the primary side FB switching power supply controller is connected with the grid of the main switch tube; the control end of the primary side FB switching power supply controller is connected to the source of the main switch tube; and the primary side FB switching power supply controller comprises an FB waveform detection module, a triangular wave generating circuit, a first comparer, a narrow pulse generating circuit, a second comparer and an RS (Reset-Set) trigger. Due to the implementation of the primary side FB switching power supply controller and the switching power supply system, provided by the invention, the system stability can be effectively improved, the complexity of a peripheral system can be lowered, the quantity of peripheral elements can be reduced, and the cost of a product can be reduced.
Owner:FREMONT MICRO DEVICES SHENZHEN LTD

Array substrate and preparation method thereof, display panel and display device

The invention discloses an array substrate and a preparation method thereof, a display panel and a display device so as to solve a problem that in a preparation process of the array substrate, because the hole depths and sizes of via holes which connect public electrodes and a public electrode line are comparatively large, waves are generated in a coating film layer in a follow-up preparation process so that the yield of the array substrate is affected. The array substrate includes an underlayer substrate, and a grid electrode metal layer, a grid electrode insulating layer, an active layer, a source and drain electrode metal layer, a passivation layer and a public electrode layer, which are formed sequentially on the underlayer substrate, and a pixel electrode layer located between the active layer and the source and drain electrode metal layer, or between the source and drain electrode metal layer and the passivation layer. The grid electrode metal layer includes a grid electrode and a public electrode line. The pixel electrode layer or the source and drain electrode metal layer includes a connection electrode. The connection electrode is electrically connected with the public electrode line through a first via hole in the grid electrode insulating layer. The connection electrode is electrically connected with the public electrodes of the public electrode layer through a second via hole in the passivation layer.
Owner:BOE TECH GRP CO LTD +1

Method of manufacturing a substrate with concave portions, a substrate with concave portions, a microlens substrate, a transmission screen, and a rear projection

A method of manufacturing a substrate 6 provided with a plurality of concave portions 61 is disclosed. The substrate 6 is used for manufacturing a microlens substrate provided with a plurality of microlenses as convex lenses which are to be formed using the plurality of concave portions 61. The method includes the steps of: preparing a base substrate 7, the base substrate 7 having two major surfaces; forming at least one layer on the one of the two major surfaces of the base substrate 7; forming a plurality of openings 81 in the at least one layer to form a mask 8, the diameter of each of the plurality of openings 81 being in the range of 0.8 to 20 μm; forming the plurality of concave portions 61 in the base substrate 7 by subjecting the base substrate 7 with the mask 8 on which the plurality of openings 81 have been formed to an etching process so that each of the formed concave portions 61 has a substantially elliptic shape; and removing the mask 8 from the base substrate 7 (6). In this case, the plurality of formed concave portions 61 are arranged on the base substrate 7 in a houndstooth check manner. Further, in the case where the depth of each of the formed concave portions 61 in a direction perpendicular to the major surface of the base substrate 7 is defined as D (μm) and the value obtained by dividing the difference between the length of each of the formed concave portions 61 in a long axis direction and the diameter of each of the formed openings 81 by two is defined as S (μm), then D and S satisfy the relation: 0.90≦S/D≦1.40. Moreover, a ratio of an area occupied by all the plurality of formed concave portions 61 in a usable area where the plurality of concave portions 61 are formed with respect to the entire usable area is 90% or more when viewed from above the one major surface of the base substrate 7.
Owner:SEIKO EPSON CORP

Digital analog double-loop low-dropout linear voltage stabilizer

The invention relates to a digital analog double-loop low-dropout linear voltage stabilizer. The voltage stabilizer comprises an operational amplifier comparison unit, a control unit and a modulationgroup unit, wherein the operational amplifier comparison unit is used for comparing an output voltage of the voltage stabilizer with a target voltage of the voltage stabilizer, and outputting a firstcomparison result and an operational amplifier amplification error value; the control unit is connected with the output ends of the operational amplifier comparison unit and the voltage stabilizer, and is used for obtaining a jump detection result according to the first comparison result and obtaining a second comparison result according to the output voltage of the voltage stabilizer; and the modulation group unit is connected with the operational amplifier comparison unit and the control unit, and modulating the output voltage of the voltage stabilizer according to the first comparison result, the operational amplifier amplification error value, the jump detection result and the second comparison result. The modulation group unit is adopted to modulate the output voltage of the voltage stabilizer, and voltage stabilization can be rapidly completed when the voltage change is relatively great, so that the transient response speed of the voltage stabilizer is increased, and the problemsof overshoot and undershoot of the output voltage of the voltage stabilizer are effectively reduced.
Owner:XIDIAN UNIV
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