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Three-layer flexible copper-clad plate hot baking tray

A flexible copper clad laminate and tray technology, which is used in the improvement of metal adhesion of insulating substrates, secondary processing of printed circuits, electrical components, etc. Guaranteed peel strength, improved product quality, and uniform heating

Inactive Publication Date: 2020-04-14
SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing baking equipment and technology make the degree of heating of different positions of the product vary greatly, and the peeling strength of the product at some positions is low, which makes it unusable for downstream FPC production

Method used

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  • Three-layer flexible copper-clad plate hot baking tray
  • Three-layer flexible copper-clad plate hot baking tray
  • Three-layer flexible copper-clad plate hot baking tray

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A three-layer flexible copper-clad laminate thermal baking tray, including a substrate 1, the substrate 1 is a circular plate, the center of the substrate 1 is provided with a main hole 2, and the diameter of the main hole is about 1 / 4-1 / 3 of the diameter of the substrate 3. Several rows of auxiliary holes 3 are provided on the surface of the substrate 1, and each row of the auxiliary holes has 3-6 holes, and the plurality of rows of the auxiliary holes 3 are evenly distributed around the center of the substrate 1. In this embodiment The auxiliary holes in each row are 45°. A group of several clamping holes 4 is arranged between every two adjacent rows of the auxiliary holes 3 . In this embodiment, there are three clamping holes 4, and the three clamping holes 4 are distributed in an isosceles triangle between two rows of auxiliary holes 3, and the clamping hole 4 at the apex of the isosceles triangle is located close to the substrate 1 On the side of the center of the...

Embodiment 2

[0028] Based on Embodiment 1, in this embodiment, several protrusions 5 are uniformly arranged on the top surface of the substrate 1 . The protrusions are metal particles or protrusions punched out by spot welding or spot stamping heads.

[0029] The tray described in Example 1 was used to accept the copper-clad laminates for thermal drying, and the average peel strength of the copper-clad laminates obtained from the five groups was 1.62 N / mm.

Embodiment 1 or Embodiment 2

[0031] For embodiment 1 or embodiment 2, the edges of the main hole 2, the auxiliary hole 3 and the clamping hole 4 in this embodiment are punched out toward the bottom surface of the substrate 1 to form a flange 6, and the flange 6 of each hole protrudes to a height of consistent. The flanging causes a gradual depression at the edge position of the front hole of the substrate.

[0032] The tray described in Example 1 was used to accept the copper-clad laminates for thermal drying, and the average peel strength of the copper-clad laminates obtained from the five groups was 1.57 N / mm.

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Abstract

The invention provides a three-layer flexible copper-clad plate hot baking tray, and mainly relates to the field of copper-clad plate preparation. The three-layer flexible copper-clad plate hot bakingtray comprises a base plate, the base plate is a circular plate, a main hole is formed in the center of the base plate, a plurality of columns of auxiliary holes are formed in the surface of the baseplate, the multiple columns of auxiliary holes are circumferentially and evenly distributed around the circle center of the base plate, and a set of multiple clamping holes are formed between every two adjacent columns of auxiliary holes. The product tray has the beneficial effects that a certain number of air holes are additionally formed in the product tray, so that high-temperature gas flow isincreased, the heat utilization efficiency of the product is improved, and the peel strength of the product is improved.

Description

technical field [0001] The invention mainly relates to the field of copper clad laminate preparation, in particular to a three-layer flexible copper clad laminate thermal baking tray. Background technique [0002] The three-layer flexible copper clad laminate has the characteristics of low cost, lightness, thinness and flexibility, and is widely used in electronic products such as smart phones, tablet computers, automotive electronics, and digital cameras. During the preparation process of the three-layer flexible copper clad laminate, it is necessary to use thermal baking equipment to cure the adhesive into shape. The existing baking equipment and technology make the different positions of the product have a large difference in the degree of heating, and the peel strength of the product in some positions is low, which makes it unusable for downstream FPC production. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the present invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/38
CPCH05K3/022H05K3/38H05K2203/1105
Inventor 李继川
Owner SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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