curable resin composition

A curable resin and composition technology, applied in the direction of electrical components, printed circuits, printed circuit parts, etc., to achieve the effect of low root mean square roughness, low roughness, and improved peel strength

Active Publication Date: 2018-07-10
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Patent Document 1 does not disclose anything about combining a phenoxy resin having an anthracene structure, an epoxy resin, and a curing agent in a specific ratio, or using a phenoxy resin having a specific epoxy equivalent.
In addition, although Patent Document 2 discloses an epoxy resin having an anthracene structure, there is nothing about combining a phenoxy resin, an epoxy resin, and a curing agent at a specific ratio, or using a phenoxy resin having a specific epoxy equivalent. public

Method used

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Examples

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Effect test

preparation example Construction

[0127] [Preparation of Curable Resin Composition]

[0128] The curable resin composition of the present invention can be prepared by mixing the above-mentioned components appropriately, and using kneading equipment such as a three-roll mill, a ball mill, a bead mill, and a sand mill, or a high-speed rotary mixer, a high-speed mixer, and a planetary mixer as needed. It is prepared by kneading or mixing with stirring equipment such as a blender. In addition, it can also be prepared as a resin varnish by further adding the above-mentioned organic solvent.

[0129] For the curable resin composition of the present invention, not only the arithmetic mean roughness of the surface of the insulating layer is low, but also the root mean square roughness is low, and a plated conductor layer with sufficient peel strength can be formed, so it can be used in multilayer printed wiring boards. It can be suitably used as a curable resin composition for an insulating layer of a multilayer prin...

Embodiment

[0166] The following examples illustrate the present invention in more detail, but the present invention is not limited by these examples. In the description below, "parts" means "parts by mass" unless otherwise specified, and "%" means "mass%" unless otherwise specified.

[0167]

[0168] First, various measurement methods and evaluation methods will be described.

[0169] [Preparation of samples for measurement of peel strength, arithmetic mean roughness (Ra value), root mean square roughness (Rq value)]

[0170] (1) Substrate treatment of laminated boards

[0171] Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (the thickness of the copper foil is 18 μm, the thickness of the substrate is 0.3 mm, R5715ES manufactured by Panasonic Electric Works Co., Ltd.) are etched 1 μm with CZ8100 manufactured by Meck Co., Ltd. Roughening of copper surfaces.

[0172] (2) Lamination of adhesive film

[0173] The adhesive films produced in Examples and C...

Embodiment 2

[0207] 5 parts of liquid naphthalene-type epoxy resin (epoxy equivalent 144, "HP4032SS" manufactured by DIC Corporation), 5 parts of crystalline bifunctional epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent about 185) 5 parts 12 parts of biphenyl-type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 269), heated and dissolved in 30 parts of mineral spirits while stirring. After cooling to room temperature (25°C), 5 parts of phenoxy resin A and a prepolymer of bisphenol A dicyanate ("BA230S75" manufactured by Ronza Japan Co., Ltd., cyanate equivalent weight about 232, 20 parts of MEK solution with 75% by mass of non-volatile content), 20 parts of novolak polyfunctional cyanate resin ("PT30S" manufactured by Ronza Japan Co., Ltd., about 133 cyanate equivalents, and 85% by mass of non-volatile content) MEK solution) 6 parts, curing accelerator (4-dimethylaminopyridine, MEK solution with a solid content of 2%...

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Abstract

The object of the present invention is to provide a curable resin composition which is excellent in elongation at break, and which not only has a low arithmetic mean roughness but also a low root mean square roughness on the surface of the insulating layer in the wet roughening process, and which can form a curable resin composition with sufficient elongation. Plated conductor layer with high peel strength and low coefficient of linear thermal expansion. The present invention provides a curable resin composition, which is a curable resin composition containing (A) a phenoxy resin having an anthracene structure, (B) an epoxy resin, and (C) a curing agent, characterized in that the above ( When the total amount of A) phenoxy resin, (B) epoxy resin, and (C) curing agent is 100% by mass, the above-mentioned (A) phenoxy resin is 1 to 15% by mass, and the above-mentioned (A) benzene The epoxy equivalent of the oxy resin is 5,000 or more.

Description

technical field [0001] The present invention relates to a curable resin composition. The present invention also relates to a curable resin composition for an insulating layer, a sheet-like laminate, a multilayer printed wiring board, and a semiconductor device containing the curable resin composition. Background technique [0002] In recent years, miniaturization and high performance of electronic devices have been progressing. In multilayer printed wiring boards, buildup layers are multilayered, and miniaturization and high density of wiring are required. [0003] Various efforts have been made to this end. For example, Patent Document 1 discloses the use of a polymer epoxy resin of a specific structure as a resin composition for printed wiring boards to improve heat resistance, low water absorption, electrical properties, formability, flexibility, impact resistance and adhesion Sexuality (claims and paragraph number 0003, etc.). However, Patent Document 1 does not discl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08K13/06C08K9/06C08K3/36C08K5/53C08G59/62C08G59/40H05K1/02
CPCC08G59/08C08G59/4028C08G59/4284C08G65/48C08K3/36C08K2201/005C08L63/00C08L71/12H05K1/0326H05K3/28
Inventor 巽志朗西村嘉生松山干川合贤司
Owner AJINOMOTO CO INC
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