Photocurable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using those materials
A resin composition, photocurable technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of poor insulation reliability of insulating materials, to achieve the improvement of flexibility, electrical characteristics, chloride ion The effect of reducing impurities
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[0180] The present invention will be specifically described below by giving Examples and Comparative Examples, but the present invention is not limited to the following Examples. Wherein, the following "parts" and "%" refer to mass standards unless otherwise specified.
Synthetic example 1
[0182] In an autoclave provided with a thermometer, a nitrogen introduction device, an alkylene oxide introduction device and a stirring device, 119.4 g of novolac cresol resin (manufactured by Showa High Molecular Co., Ltd., trade name "Shonol CRG951", OH equivalent: 119.4), 1.19g of potassium hydroxide and 119.4g of toluene, while stirring, the system was replaced with nitrogen, and the temperature was raised. Then, slowly drop 63.8g of propylene oxide, at 125~132℃, 0~4.8kg / cm 2 The reaction was carried out for 16 hours. Then, after cooling to room temperature, 1.56 g of 89% phosphoric acid was added to the reaction solution to neutralize potassium hydroxide to obtain propylene oxide of novolak-type cresol resin with 62.1% non-volatile content and 182.2 g / eq. of hydroxyl value. reaction solution. This is a substance in which 1.08 moles of alkylene oxide were added on average per 1 equivalent of phenolic hydroxyl group.
[0183] Next, 293.0 g of the propylene oxide reactio...
Synthetic example 2
[0185] In a 5-liter separable flask equipped with a thermometer, a stirrer, and a reflux condenser, 1245 g of polycaprolactone diol (Placcel 208 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD., molecular weight 830), 201 g of Dimethylolpropionic acid as a dihydroxy compound having a carboxyl group, 777 g of isophorone diisocyanate as a polyisocyanate, and 119 g of 2-hydroxyethyl acrylate as a (meth)acrylate having a hydroxyl group are further charged with 0.5 g of p-methoxyphenol and di-tert-butylhydroxytoluene. Heating was stopped at 60° C. while stirring, and 0.8 g of dibutyltin dilaurate was added. If the temperature in the reaction vessel begins to drop, then heat again, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group in the infrared absorption spectrum (2280cm -1 ) disappears, the reaction is stopped, and a viscous liquid urethane acrylate compound is obtained. Adjust to non-volatile content = 50% using carbitol acetate. A resin ...
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