Gluing device and gluing method

Abstract

The present invention provides a gluing device and a gluing method, the gluing device comprises: a drip nozzle for guiding the adhesive along the dripping direction, the adhesive is added with a magnetic material; a magnetic field generating structure, It is used to apply an induced magnetic field to the dripping head, and the magnetic material exerts the same or opposite force to the dripping direction through the induced magnetic field. The present invention adds a magnetic material to the adhesive to be dripped, and uses the induced magnetic field applied to the dripping head to apply the same or opposite force to the magnetic material in the dripping direction, so that the magnetic material acts on the adhesive to achieve the purpose of controlling the flow rate of the adhesive in the dripping direction, so that the adhesive in the gluing device can drip out smoothly, and the flow rate is more uniform, which solves the problem of air pressure or pressure when gluing in the prior art. Insufficient glue breaking and glue line thinning.

Description

technical field [0001] The invention relates to the technical field of packaging equipment, in particular to a gluing device and a gluing method. Background technique [0002] Currently, in the field of display manufacturing, component packaging is an essential process. For example, in the manufacture of organic light-emitting diodes, also known as organic electroluminescence displays (Organic Electroluminescence Display, OLED), better packaging of OLEDs has become one of the key issues to prolong their service life. [0003] In the traditional encapsulation of OLEDs, the device is generally encapsulated by UV-cured epoxy resin. When encapsulating OLED devices, it is often necessary to apply epoxy resin adhesives on a large scale to bond each layer of the board. In order to improve production efficiency, glue applicators are mostly used for this work. The traditional gluing machine generally uses air pressure or screw pressure to apply the adhesive to the cover glass, and...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the technical solution of the present invention is to provide a gluing device and a gluing method, which are used to control the outflow speed of the glue material in the gluing machine, and solve the problem of glue breaking and gluing caused by uneven air pressure or pressure when gluing in the prior art. The problem of glue line thinning

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