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Substrate for light-emitting element, light-emitting component, and manufacturing method of light-emitting component

A light-emitting element and substrate technology, which is applied in the direction of electrical components, semiconductor/solid-state device parts, electric solid-state devices, etc., to achieve the effect of suppressing brightness decline and achieving long life

Active Publication Date: 2017-03-01
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned Japanese Patent Application Laid-Open No. 2003-133596 has no specific structure (types, thicknesses, order of combination, etc. of various metal materials (metal layers) constituting the metal substrate) when the metal substrate is composed of multiple metal materials. public

Method used

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  • Substrate for light-emitting element, light-emitting component, and manufacturing method of light-emitting component
  • Substrate for light-emitting element, light-emitting component, and manufacturing method of light-emitting component
  • Substrate for light-emitting element, light-emitting component, and manufacturing method of light-emitting component

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no. 1 approach

[0053] First, refer to Figure 1 to Figure 4 , the structure of the LED assembly 100 according to the first embodiment of the present invention will be described. In addition, the LED module 100 is an example of the "light emitting module" of this invention.

[0054] Such as figure 1 and figure 2 As shown, in the LED module 100 according to the first embodiment of the present invention, one side (X1 side) is connected to the Cu wiring 102a of the printed circuit board 102 through solder 101a, and the other side (X2 side) is connected to the printed circuit board 102a through solder 101b. Cu wiring 102 b of the circuit board 102 . Accordingly, the light emission of the LED module 100 is controlled by a control unit (not shown) separately connected to the printed circuit board 102 .

[0055] In addition, the LED assembly 100 includes: a plate-shaped lead frame (lead frame) 1 divided into the X1 side and the X2 side, the LED element 2 fixed on the one surface 1a of the X1 si...

no. 2 approach

[0098] Next, refer to Figure 8 and Figure 9 , the second embodiment of the present invention will be described. In this second embodiment, unlike the above-mentioned first embodiment, the description will be made on the case where, in the LED module 300 , the outer layer 311 made of Ag or Al is arranged on the one surface 301 a of the lead frame 301 , and the The other surface 301b is provided with an inner layer 313 made of Ag or Al. In addition, the LED module 300 is an example of the "light-emitting module" of the present invention, and the lead frame 301 is an example of the "substrate for light-emitting element" of the present invention. In addition, the outer layer 311 and the inner layer 313 are an example of the "first layer" and "third layer" of this invention, respectively.

[0099] In the second embodiment of the present invention, as Figure 8and Figure 9 As shown, the lead frame 301 is composed of a three-layer cladding structure in which an outer layer 31...

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Abstract

This substrate (1) for light emitting elements is provided with: a first layer (11) that is formed of Cu, Ag, Al, an Cu alloy, an Ag alloy or an Al alloy and a second layer (12) that is formed of Fe or an Fe alloy, said layers being arranged on one surface (1a), on which a light emitting element (2) is arranged; and a third layer (13) that is formed of Cu, Ag, Al, an Cu alloy, an Ag alloy or an Al alloy and arranged on the other surface (1b). The surface (1a) is formed to have a kurtosis (Rku) of 10.5 or less and an arithmetic mean roughness (Ra) of 0.15 mum or less.

Description

technical field [0001] The present invention relates to a substrate for a light-emitting element, a light-emitting component, and a method for manufacturing the light-emitting component, and more particularly, to a substrate for a light-emitting element on which a light-emitting element is disposed, a light-emitting component having the substrate for a light-emitting element, and a method for manufacturing the light-emitting component. Background technique [0002] Heretofore, substrates for light-emitting elements for disposing light-emitting elements are known. Such a substrate for a light-emitting element is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-133596. [0003] The above-mentioned Japanese Patent Application Laid-Open No. 2003-133596 discloses an LED display device including: a metal substrate (a substrate for a light-emitting element), and an insulating material arranged on the surface of the metal substrate to form a recess. layer, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62
CPCH01L33/62H01L23/49579H01L24/32H01L24/45H01L24/48H01L24/73H01L33/60H01L33/64H01L2224/32225H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/48237H01L2224/73265H01L2224/85205H01L2924/12041H01L2924/181
Inventor 山本晋司渡边启太石尾雅昭
Owner HITACHI METALS LTD