A punching die anti-sticking material mechanism
An anti-sticking material and die technology, applied in the field of stamping die, can solve problems such as damaged products and safety accidents, and achieve the effect of improving quality, avoiding sticking, and ensuring operation safety.
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[0014] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0015] see figure 1 as shown, figure 1 It is a structural schematic diagram of the die release material mechanism provided in Embodiment 1 of the present invention.
[0016] In this embodiment, a die anti-adhesive mechanism includes a positioning sleeve 1, a punch rod 2, and a discharge device 3. The positioning sleeve 1 is provided with three-stage stepped holes, and the three-stage stepped holes form a first connected sequentially. A slide chamber 4, a second slide chamber 5, and a third slide chamber 6, wherein a discharge device 3 is slidably arranged in the third slide chamber 6, and the tail end of the discharge device 3 is provided with a A limiting plate 7, the limiting plate 7 is arranged in the second slide chamber 5, and a punching rod 2 is slidably arranged in the discharge device 3, a...
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