Unlock instant, AI-driven research and patent intelligence for your innovation.
Primer composition and optical semiconductor apparatus using same
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology for optical semiconductor devices and primers, applied in semiconductor devices, coatings, electro-solid devices, etc., can solve the problems of insufficient heat resistance of primer films, resin deterioration, film cracks, etc., and achieve excellent adhesion, Corrosion prevention and high reliability effects
Active Publication Date: 2014-07-23
SHIN ETSU CHEM IND CO LTD
View PDF10 Cites 7 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
However, when using acrylic polymers containing SiH groups, the heat resistance of the primer film is not sufficient, and the resin deteriorates in the vicinity of semiconductor elements where a relatively high current flows in recent years.
On the other hand, although polysilazane compounds are excellent in heat resistance, polysilazane films are relatively stiff, so it is best to apply them to a structure in which a plurality of optical semiconductor elements called multi-chips are mounted. Once on the substrate, the film will rupture
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0116] Hereinafter, although a synthesis example, an Example, and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to the following example.
Synthetic example 1
[0117] [Synthesis Example 1] Synthesis of polysilazane compound
[0118] Put 1,000 g of ethyl acetate into a 2 L four-necked flask equipped with a coiled cooler and a thermometer, and add 3.8 g (0.015 mol) of methacryloxypropyl trichlorosilane into the ethyl acetate 1. 41.5 g (0.28 mol) of methyltrichlorosilane was stirred in an ice bath. 15 g (0.89 mol) of ammonia gas was blown in when the inside of the system became 10 degreeC or less, and it stirred for 3 hours after blowing in. After completion of the stirring, by-product ammonium chloride was filtered off to complete a 4% by mass polysilazane solution of ethyl acetate.
[0119] use 29 Si-NMR, 1 When the synthesized polysilazane compound was measured by H-NMR, the structure of the polysilazane was as shown below, and the weight average molecular weight measured by GPC (tetrahydrofuran solvent (THF solvent)) was 2,000.
[0120]
Synthetic example 2
[0121] [Synthesis Example 2] Synthesis of polysilazane compound
[0122] Put 1,000 g of ethyl acetate into a 2 L four-necked flask equipped with a coiled cooler and a thermometer, and add 19 g (0.15 mol) of dimethyldichlorosilane, methyltrichlorosilane, and 22.5g (0.15mol), stirred under ice bath conditions. 14 g (0.83 mol) of ammonia gas was blown in when the inside of the system became 10 degreeC or less, and it stirred for 3 hours after blowing in. After completion of the stirring, by-product ammonium chloride was filtered off to complete a 4% by mass polysilazane solution of ethyl acetate.
[0123] use 29 Si-NMR, 1 When the synthesized polysilazane compound was measured by H-NMR, the structure of the polysilazane was as shown below, and the weight average molecular weight measured by GPC (THF solvent) was 2,000.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention aims at providing a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode on the substrate can be prevented, and the heat resistance and flexibility of a primer can be improved. In order to solve the problem, the primer composition is provided. The primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, includes (A) silazane compound or polysilazane compounds that has one or more silazane bonds in the molecule, (B) acrylic resin containing either one or both of acrylate ester and methacrylate ester that contains one or more SiH groups in the molecule, and (C) solvent.
Description
technical field [0001] The present invention relates to a primer composition and an optical semiconductor device using the primer composition. The primer composition is an addition reaction curing type that combines a substrate on which an optical semiconductor element is mounted and seals the optical semiconductor element. Adhesion of cured silicone composition. Background technique [0002] An LED lamp known as an optical semiconductor device has a light emitting diode (Light Emitting Diode, LED) as an optical semiconductor element, and the LED mounted on a substrate is sealed with a sealing material made of a transparent resin. Make a seal. Conventionally, epoxy resin-based compositions have been commonly used as sealing materials for sealing such LEDs. However, in epoxy resin-based sealing materials, along with recent miniaturization of semiconductor packages and higher brightness of LEDs, the amount of heat generated has increased and the wavelength of light has becom...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
Login to View More