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A kind of LED chip and its manufacturing method

A technology of LED chips and electrodes, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of small electrode spacing and packaging difficulties, and achieve the effect of increasing distance, reducing difficulty, and realizing high-voltage working mode

Inactive Publication Date: 2018-01-16
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The main technical problem to be solved by the present invention is to provide an LED chip and its manufacturing method, which can realize the high-voltage working mode, and can also overcome the disadvantage of difficult packaging caused by small electrode spacing

Method used

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  • A kind of LED chip and its manufacturing method
  • A kind of LED chip and its manufacturing method
  • A kind of LED chip and its manufacturing method

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Embodiment Construction

[0022] see figure 1 , figure 1 It is a schematic structural diagram of an LED chip provided by an embodiment of the present invention. like figure 1 As shown, the LED chip 10 of this embodiment includes a substrate 11 and a plurality of electrically isolated LED light-emitting epitaxial structures 12 disposed on the substrate 11 . Wherein, each LED light-emitting epitaxial structure 12 includes a P-type electrode 121 and an N-type electrode 122, and the P-type electrodes 121 and N-type electrodes 122 of a plurality of LED light-emitting epitaxial structures 12 are electrically connected in sequence through an electrical connection line 13, so that the LED chip 10 The working voltage can be formed by working voltages of multiple LED light-emitting epitaxial structures 12, so as to realize a high-voltage working mode. In this embodiment, the P-type electrodes 121 and N-type electrodes 122 respectively include the respective first P-type electrodes 1211 and first N-type electr...

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Abstract

The invention discloses an LED chip and a manufacturing method of the LED chip. The LED chip comprises a plurality of electrically isolated LED light-emitting extension structures, and P-type electrodes and N-type electrodes of the multiple LED light-emitting extension structures are electrically connected in sequence. The P-type electrodes and the N-type electrodes respectively comprise a first P-type electrode and a first N-type electrode of at least two LED light-emitting extension structures located at the edge of the LED chip, the upper surfaces of the multiple LED light-emitting extension structures comprise a first area and a second area, the first area comprises the upper surface of the first P-type electrode and the upper surface of the first N-type electrode, the second area comprises the area except the first area, the second area is provided with a first insulating medium film layer, the first P-type electrode and the first N-type electrode are respectively provided with an extension part in an extending mode, and each extension part extends upwards along the lateral wall of the first insulating medium film layer and extends inwards from the edge of the first insulating medium film layer. Through the structure of the LED chip, the packaging difficulty is lowered, and a high-voltage work mode is achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an LED chip and a manufacturing method thereof. Background technique [0002] The structure of the LED chip in the prior art includes a front-chip structure and a flip-chip structure. Among them, the LED chip with the front mounting structure needs to paste the substrate on the tube shell when packaging, and the distance from the light-emitting area to the heat dissipation tube shell is long, so the thermal resistance is large, which is not conducive to heat dissipation. Therefore, in order to improve the heat dissipation effect, a flip-chip structure is usually used. When packaging an LED chip with a flip-chip structure, the chip electrode is directly welded to the shell electrode, which has a very low thermal resistance. However, the LED chip with the flip-chip structure has low operating voltage, low light efficiency and small electrode spacing, which makes packaging d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/38H01L33/62H01L33/00
CPCH01L33/005H01L33/38H01L2933/0016
Inventor 柴广跃
Owner SHENZHEN UNIV