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Gas barrier film and electronic equipment

A gas barrier film and gas barrier technology, applied in electrical equipment shells/cabinets/drawers, circuits, electrical components, etc., can solve problems such as poor productivity, scratches and cracks on resin matrix materials, and achieve high gas barrier performance Effect

Inactive Publication Date: 2015-07-29
KONICA MINOLTA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is intended to suppress the generation of cracks during VUV light irradiation by thinning the polysilazane coating film, and to improve the gas barrier property by stacking multiple layers and increasing the thickness of the film. However, even in the case of laminating thin layers However, if the total film thickness of the gas barrier layer exceeds a certain value, cracks will also occur, so the gas barrier properties required for electronic devices cannot be obtained.
In addition, multi-layer lamination is the premise, and the resin base material with a smooth surface is prone to scratches during transportation, so it is a technology with poor productivity including yield.

Method used

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  • Gas barrier film and electronic equipment
  • Gas barrier film and electronic equipment
  • Gas barrier film and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0310] "Manufacturing of Barrier Matrix Materials"

[0311] [Preparation of barrier base material (1)]

[0312] As the thermoplastic resin base material (base material 11), a polyester film with a thickness of 125 μm (manufactured by Teijin DuPont Film Co., Ltd., ultra-low thermal shrinkage PET Q83) with an easy-adhesive process on both sides was used. A film formed with an anti-bleeding layer and a smooth layer on the other side was used as a barrier base material (1).

[0313]

[0314] Under the condition that the film thickness after drying was 4.0 μm, the UV-curable organic / inorganic hybrid hard coating material OPSTAR Z7535 manufactured by JSR Co., Ltd. was coated on one side of the thermoplastic resin base material (base material 11). Dry at 80°C for 3 minutes, and use a high-pressure mercury lamp to irradiate with an energy of 1.0J / cm in an air atmosphere 2 Curing treatment is performed by irradiating with light to form an anti-bleeding layer.

[0315]

[0316] N...

Embodiment 2

[0395] 《Manufacturing of Electronic Devices and Organic EL Panels》

[0396] A part of the gas barrier film (No. 1, 3, 5, 7, 11, 13, 15, 16, 19, 21) produced in Example 1 was used as a sealing film to seal an organic EL element as an electronic device, and produced as Organic EL panels for electronic equipment (element Nos. 1 to 10). In addition, the gas barrier film used here was obtained by repeating 100 times of reciprocating bending corresponding to 20 mmφ by the same method as in Example 1.

[0397] Here, the outline of the organic EL panel will be described. in addition, image 3 The organic EL panel 20 shown as an example in hereinafter will be described by taking a structure using the gas barrier film 10 as an example.

[0398] Such as image 3 As shown, the organic EL panel 20 has a first electrode layer 22, a hole transport layer 23, a light emitting layer 24, an electron transport layer 25, an electron injection layer 26, a second The structure of the electrode ...

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Abstract

A gas barrier film (10) that comprises a gas barrier layer (14), which is obtained by irradiating a layer that contains a polysilazane with vacuum ultraviolet light, on a base (11) is formed to contain a compound (A) that satisfies all of the conditions (a), (b) and (c) described below in an amount within the range from 1% by mass to 40% by mass (inclusive) relative to the total mass of the gas barrier layer. (a) The compound (A) has an Si-O bond and an organic group that is directly bonded to Si. (b) The compound (A) has an Si-H group or an Si-OH group. (c) The compound (A) has a molecular weight of from 90 to 1,200 (inclusive).

Description

technical field [0001] The invention relates to a gas barrier film and electronic equipment using the gas barrier film. Background technique [0002] At present, gas barrier films formed by laminating multiple layers of metal oxide films such as aluminum oxide, magnesium oxide, and silicon oxide on the surfaces of plastic substrates and resin films are widely used in various applications that need to block water vapor and oxygen. Packaging applications for gaseous articles, for example, packaging applications for preventing deterioration of food, industrial supplies, and pharmaceuticals. [0003] In addition to packaging applications, gas barrier films are also expected to be applied to sealing electronic devices such as flexible solar cell elements, organic electroluminescence (EL) elements, and liquid crystal display elements, and a lot of research has been conducted. However, the sealing of these electronic devices requires very high gas barrier properties at the level o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00C08J7/043C08J7/048
CPCY10T428/24364C08J7/04Y10T428/265Y10T428/239H01L51/5246H05K5/069H01L51/5253C08J7/042C08J2483/16C08J7/0427C08J7/048C08J7/043H10K50/844H10K50/8426
Inventor 森孝博
Owner KONICA MINOLTA INC
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