Resin covering device

Abstract

The invention provides a resin cover device. When a framework is cleaned, partial stripping of a water soluble resin coated on a wafer can be prohibited, the water soluble resin is well coated on the upper surface of the wafer, the resin cover device is configured in such a way that a protection band (T) is attached on an annular framework (F), and the water soluble resin is attached on the upper surface of the wafer (W) of the protection band in a covering manner. The resin cover device is provided with a water soluble resin spray nozzle (4), an air curtain forming unit (6) and a cleaning water supply unit (5), wherein the water soluble resin is coated on the upper surface of the water and therefore a protection film (11) is formed, an air curtain which separates the wafer and the annular framework is formed by the air curtain forming unit (6), and cleaning water is supplied to the annular framework by the cleaning water supply unit at a position which is closer to the outside than the air curtain relative to the wafer.

Description

technical field [0001] The present invention relates to a resin coating device for coating the upper surface of a wafer before laser processing with a water-soluble resin. Background technique [0002] In the manufacturing process of a semiconductor device, streets are formed in a grid pattern on the surface of a wafer, and devices such as ICs and LSIs are formed in regions defined by the streets. The wafer is separated vertically and horizontally along grid-like intervals and divided into individual devices. As a method of dividing the wafer along the streets, a method of dividing by laser processing may be used for reasons such as reducing debris. However, when the laser beam is irradiated on the surface of the wafer, droplets called debris generated by melting of the wafer splash and adhere to the surface of the device to degrade the quality. [0003] Therefore, in order to prevent the splashed debris from directly adhering to the device, the present applicant discovere...

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Problems solved by technology

[0008] In the frame cleaning described in Patent Document 2, there is a problem that if the turntable is not rotated at a high speed, sufficient centrifugal force will not act on the cleaning water, and there is a risk that the cleaning water may splash onto the upper surface of the wafer.

Therefore, as in the case of thickening the resin film, when the turntable cannot be rotated at a high speed after the coating of the water-soluble resin, the water-soluble resin coated on the wafer will be partially peeled off due to the splashed cleaning water, and there will be subsequent problems. There is a risk of deterioration in the quality of the device due to the adhesion of debris during the laser processing of the process

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