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Manufacturing method of electronic device

A technology of electronic devices and manufacturing methods, which is applied in the manufacturing of printed circuits, inductors/transformers/magnets, inductors, etc., to achieve the effect of suppressing distortion

Active Publication Date: 2017-10-13
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Causes of Cracks in the Laminate 512 Due to the Distortion

Method used

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  • Manufacturing method of electronic device
  • Manufacturing method of electronic device
  • Manufacturing method of electronic device

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Hereinafter, the manufacturing method of the electronic device which concerns on embodiment of this invention is demonstrated.

[0023] (Structure of Electronic Devices)

[0024] Hereinafter, the configuration of an electronic device according to an embodiment will be described with reference to the drawings. figure 1 It is an external perspective view of the electronic device 10 according to one embodiment. figure 2 for figure 1 An exploded perspective view of the electronic device 10 . Hereinafter, the stacking direction of the electronic device 10 is defined as the y-axis direction. Furthermore, the direction in which the long sides of the electronic device 10 extend is defined as the x-axis direction when viewed from the y-axis direction, and the direction in which the short sides of the electronic device 10 extends is defined as the z-axis direction.

[0025] like figure 1 as well as figure 2 As shown, the electronic device 10 is provided with the lamina...

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Abstract

The present invention provides a method of manufacturing an electronic device capable of suppressing twisting of a laminated body when cutting a mother laminated body. In the method for manufacturing an electronic device, the electronic device includes: a laminate (12) formed by stacking a plurality of rectangular insulator layers, and having a mounting surface formed by connecting first sides of the plurality of insulator layers; A component is provided in the laminated body (12); and an external conductor is electrically connected to the circuit component and drawn out toward the long side. In the cutting process, before cutting the mother laminate (112) along the cutting line (CL3), the mother laminate (112) is cut along the cutting line (CL2) extending toward the Z-axis direction, and the cutting line (CL3) faces the x-axis direction The extended and combined conductors (114) are aligned at the cutting line (CL3).

Description

technical field [0001] The present invention relates to a method of manufacturing an electronic device, and more specifically, to a method of manufacturing an electronic device obtained by laminating insulator layers. Background technique [0002] As an invention related to a conventional manufacturing method of an electronic device, for example, a common-mode noise filter described in Patent Document 1 is known. Figure 11 It is a perspective view of the mother laminate 512 of the common mode noise filter 500 described in Patent Document 1. FIG. [0003] The common mode noise filter 500 includes a laminated body 502 and external electrodes 504a and 504b. The external electrodes 504 a and 504 b span both surfaces of the laminated body 502 , respectively. The common mode noise filter 500 described above is produced by cutting the mother laminate 512 in which the laminates 512 are arranged in a matrix. In dicing, for example, after the mother laminate 512 is cut along a cutt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00H01F17/00
CPCH01F41/041H01F17/0013H05K3/0052H05K2203/0228Y10T156/1052
Inventor 世古笃史
Owner MURATA MFG CO LTD