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Signal transmission cable

A signal transmission and cable technology, applied in the direction of insulated cables, distribution line transmission systems, cables, etc., can solve problems such as exceeding the transmission capacity of signal lines, and achieve the effect of high-speed communication

Inactive Publication Date: 2014-08-20
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For example, consider performing parallel-to-serial conversion and serial-to-parallel conversion and transferring data serially to reduce the number of signal lines, but each signal line has been exceeded due to high-speed transmission requirements associated with the complexity of recent devices transmission capacity

Method used

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  • Signal transmission cable
  • Signal transmission cable
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Examples

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Embodiment Construction

[0031] Hereinafter, embodiments of the technology disclosed herein will be described with reference to the accompanying drawings.

[0032] figure 1 An example of the external configuration of the flexible flat cable 10 according to the embodiment of the present technology is shown.

[0033] Such as figure 1 As shown, the flexible flat cable 10 is configured to connect the transmission side connector 11 and the reception side connector 12 via the cable 13.

[0034] For example, in electronic devices such as mobile phones, smart phones, notebook computers, and digital cameras, the flexible flat cable 10 is used as a cable that connects substrates to each other.

[0035] For example, the transmitting-side connector 11 is connected to the substrate of an image sensor module in a smartphone, and the receiving-side connector 12 is connected to the substrate of a signal processing module in the smartphone. In addition, the cable 13 is formed of a material that can be easily bent. For exampl...

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Abstract

A signal transmission cable comprises a cable including a dielectric layer and a metallic layer; and a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Description

[0001] Cross reference of related applications [0002] This application claims the priority of the Japanese priority patent application JP2013-030402 filed on February 19, 2013, the disclosure of which is incorporated herein by reference. Technical field [0003] The present technology relates to signal transmission cables, and in particular, to signal transmission cables that can realize high-quality, high-speed communication without increasing the installation space of the cable. Background technique [0004] In recent years, the functions of mobile phones, smart phones, notebook computers, digital cameras, etc. have been significantly improved, and the display elements or imaging elements embedded in these electronic devices are required to have high resolution and high definition, so these electronic devices are becoming more and more complex. [0005] In particular, in mobile phones, smart phones, etc., a built-in camera function, enlargement of the display unit, high functiona...

Claims

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Application Information

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IPC IPC(8): H01B7/40H04B3/54
CPCH05K1/0219H05K2201/09618H01P3/08H05K2201/09336H01P3/121H05K2201/0715H01R13/6599H01P3/085H01R13/6691H01R24/64H01R2107/00
Inventor 秋叶朗桥本光生盛田伸也御手洗后竹友干裕鬼木一直池田浩一
Owner SONY CORP