Copper strip surface passivation device

A copper strip and passivation solution technology, applied in the direction of metal material coating process, can solve the problems of poor passivation quality, easy damage to the film, low passivation efficiency, etc., to achieve automatic production operations, improve passivation The effect of high efficiency and passivation efficiency

Inactive Publication Date: 2014-08-27
ANHUI YONGJIE COPPER
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing copper strip surface passivation treatment device has a complex structure, low passivation efficiency, high cost, and poor passivation quality. During the subsequent transportation and storage of the copper strip, the passivation film on the copper strip surface is easily damaged

Method used

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  • Copper strip surface passivation device
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  • Copper strip surface passivation device

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Embodiment Construction

[0022] The specific implementation manner of the present invention will be described in further detail below by describing the embodiments with reference to the accompanying drawings.

[0023] like figure 1 As shown, the device for copper strip surface passivation includes a passivation box 1 and a passivation solution arranged in the passivation box 1, and a copper strip feeding inlet is provided on the passivation box 1 side, and the passivation The other side of the box 1 is provided with an outlet for the copper strip after passivation, the inlet and the outlet are flush, and the height of the passivation solution in the passivation box 1 is lower than the height of the outlet and the inlet; the inner inlet and outlet of the passivation box 1 There is a structure in between for bringing the copper strip into contact with the passivation solution.

[0024] Wherein, the passivation solution contains benzotriazole, deionized water and sodium fluorosilicate, and the passivati...

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PUM

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Abstract

The invention discloses a copper strip surface passivation device comprising a passivation tank and a passivation solution arranged in the passivation tank, wherein one side of the passivation tank is provided with an inlet for feeding a copper strip, and the other side of the passivation tank is provided with an outlet for discharging a passivated copper strip; and a structure for enabling the copper strip to be in contact with the passivation solution is arranged between the inlet and the outlet in the passivation tank. The device can be used for realizing online passivation treatment, and passivation operation can be continuously carried out if only the copper strip on a production line passes through the passivation tank, so that the passivation efficiency is high; the passivation solution in the passivation tank is circularly filtered through a filter to remove copper powder and other particles entering from the surface of the copper strip to the passivation solution in a passivation process, so that the purity of the passivation solution is ensured, and furthermore, the passivation quality is ensured; and in addition, the passivation solution does not need to be replaced frequently, so that the passivation efficiency is increased, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of copper strip processing, in particular to a device for passivating the surface of copper strips. Background technique [0002] If the surface of the copper strip is not passivated, it will be in direct contact with the air, oxidized and discolored, and the surface of the copper strip is easily corroded. [0003] The existing copper strip surface passivation treatment device has a complex structure, low passivation efficiency, high cost, and poor passivation quality. During the subsequent transportation and storage of the copper strip, the passivated film on the copper strip surface is easily damaged. Contents of the invention [0004] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a device for passivating the surface of copper strips, so as to achieve the purpose of high passivation efficiency on the surface of copper strips. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/73C23C22/77
Inventor 陶俊兵张俊
Owner ANHUI YONGJIE COPPER
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