Packaging structure and packaging method for fingerprint recognition chip

A technology of chip packaging structure and fingerprint recognition, which is applied in character and pattern recognition, acquisition/sorting of fingerprints/palmprints, matching and classification, etc. It can solve the problems of fingerprint recognition device manufacturing and application limitations, fingerprint recognition chip sensitivity requirements, etc. , to meet the requirements of low cost, lower sensitivity and wide application

Active Publication Date: 2014-09-17
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the existing fingerprint identification devices, the sensitivity of the fingerprint identificati

Method used

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  • Packaging structure and packaging method for fingerprint recognition chip
  • Packaging structure and packaging method for fingerprint recognition chip
  • Packaging structure and packaging method for fingerprint recognition chip

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0036] As mentioned in the background, in the existing fingerprint identification devices, the sensitivity of the fingerprint identification chip is required to be high, so that the manufacture and application of the fingerprint identification devices are limited.

[0037] After research, please continue to refer to figure 1, the surface of the fingerprint identification chip 101 is covered with a glass substrate 102, the glass substrate 102 is used to protect the fingerprint identification chip 101, and the user's finger 103 is directly in contact with the glass substrate 102, therefore, in order to ensure that the glass substrate 102 has For sufficient protection capability, the thickness of the glass substrate 102 is relatively thick. However, since the glass substrate 102 is relatively thick, the fingerprint recognition chip 101 is required to have high sensitivity to ensure that the user's fingerprint can be accurately extracted. However, it is difficult to manufacture a...

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Abstract

The invention discloses a packaging structure and a packaging method for a fingerprint recognition chip. The packaging structure comprises a substrate, a sensing chip, an upper cover layer and a plastic package layer. The sensing chip is coupled to the surface of the substrate and provided with a first surface and a second surface opposite to the first surface, the first surface of the sensing chip is provided with a sensing area, and the second surface of the sensing chip is located on the surface of the substrate. The upper cover layer is at least located on the surface of the sensing area of the sensing chip and is made of polymers. The plastic package layer is located on the surface of the substrate and the surface of the sensing chip, and the plastic package layer is exposed out of the upper cover layer. According to the packaging structure, the requirement for the sensitivity of the sensing chip is lowered, and application is wider.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a fingerprint identification chip packaging structure and packaging method. Background technique [0002] With the progress of modern society, the importance of personal identification and personal information security has gradually attracted people's attention. Due to the uniqueness and invariance of human fingerprints, fingerprint identification technology has the characteristics of good security, high reliability, and simple and convenient use, making fingerprint identification technology widely used in various fields to protect personal information security. With the continuous development of science and technology, the information security of various electronic products has always been one of the key points of technological development. Especially for mobile terminals, such as mobile phones, notebook computers, tablet computers, digital cameras, etc., th...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/60H01L21/56G06K9/00
CPCH01L21/56H01L23/60H01L2224/48091H01L2224/73265H01L24/45H01L2924/00014H01L23/3121H01L24/48H01L2224/45124H01L2224/45139H01L2224/45144H01L2224/45147H01L2224/45184H01L2224/24225H01L2224/82106H01L24/24H01L24/82H01L2224/73267H01L2224/13101H01L2224/13025H01L24/16H01L24/13H01L2924/181H01L2224/92247H01L24/92H01L24/05H01L2924/10155H01L2224/05558G06V40/1329H01L2224/05599H01L2224/85399H01L2224/32225H01L2224/48227H01L2924/00012H01L2924/014H01L23/31G06F18/00G06V40/1306G06V40/1365H01L23/04H01L23/295H01L23/3135H01L24/32H01L24/83H01L2224/48106H01L2924/00
Inventor 王之奇喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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