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Encapsulation structure and encapsulation method of fingerprint recognition chip

A chip packaging structure, fingerprint recognition technology, applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, matching and classification, etc. problems, to achieve the effect of low cost, reduced sensitivity, and good coverage

Active Publication Date: 2017-06-20
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the existing fingerprint identification devices, the sensitivity of the fingerprint identification chip is required to be high, which limits the manufacture and application of fingerprint identification devices.

Method used

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  • Encapsulation structure and encapsulation method of fingerprint recognition chip
  • Encapsulation structure and encapsulation method of fingerprint recognition chip
  • Encapsulation structure and encapsulation method of fingerprint recognition chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] As mentioned in the background, in the existing fingerprint identification devices, the sensitivity of the fingerprint identification chip is required to be high, so that the manufacture and application of the fingerprint identification devices are limited.

[0037] After research, please continue to refer to figure 1, the surface of the fingerprint identification chip 101 is covered with a glass substrate 102, the glass substrate 102 is used to protect the fingerprint identification chip 101, and the user's finger 103 is directly in contact with the glass substrate 102, therefore, in order to ensure that the glass substrate 102 has For sufficient protection capability, the thickness of the glass substrate 102 is relatively thick. However, since the glass substrate 102 is relatively thick, the fingerprint recognition chip 101 is required to have high sensitivity to ensure that the user's fingerprint can be accurately extracted. However, it is difficult to manufacture a...

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PUM

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Abstract

A fingerprint identification chip packaging structure and packaging method, the packaging structure includes: a substrate; an induction chip coupled to the surface of the substrate, the induction chip has a first surface and a second surface opposite to the first surface, the induction chip The first surface has a sensing area, the second surface of the sensing chip is located on the substrate surface; at least the upper cover layer is located on the sensing area surface of the sensing chip, and the material of the upper cover layer is a polymer; the upper cover layer is located on the substrate and the sensing chip surface A plastic sealing layer, the plastic sealing layer exposes the upper cover layer. The encapsulation structure can lower the requirement on the sensitivity of the sensing chip and has wider application.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a fingerprint identification chip packaging structure and packaging method. Background technique [0002] With the progress of modern society, the importance of personal identification and personal information security has gradually attracted people's attention. Due to the uniqueness and invariance of human fingerprints, fingerprint identification technology has the characteristics of good security, high reliability, and simple and convenient use, making fingerprint identification technology widely used in various fields to protect personal information security. With the continuous development of science and technology, the information security of various electronic products has always been one of the key points of technological development. Especially for mobile terminals, such as mobile phones, notebook computers, tablet computers, digital cameras, etc., th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/60H01L21/56G06K9/00
CPCH01L21/56H01L23/60H01L2224/48091H01L2224/73265H01L24/45H01L2924/00014H01L23/3121H01L24/48H01L2224/45124H01L2224/45139H01L2224/45144H01L2224/45147H01L2224/45184H01L2224/24225H01L2224/82106H01L24/24H01L24/82H01L2224/73267H01L2224/13101H01L2224/13025H01L24/16H01L24/13H01L2924/181H01L2224/92247H01L24/92H01L24/05H01L2924/10155H01L2224/05558G06V40/1329H01L2224/05599H01L2224/85399H01L2224/32225H01L2224/48227H01L2924/00012H01L2924/014H01L23/31G06F18/00G06V40/1306G06V40/1365H01L23/04H01L23/295H01L23/3135H01L24/32H01L24/83H01L2224/48106H01L2924/00
Inventor 王之奇喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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