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Detaching apparatus

A peeling device, a technology of plate-shaped body, applied in the directions of printing, rotary printing machine, printing machine, etc., can solve the problems of not taking into account, pattern damage and so on

Inactive Publication Date: 2014-10-01
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, as described above, the pattern and the like are damaged due to local concentration of stress on the pattern and the like, so it is necessary to consider the device structure for receiving the close-fitting body from the outside without generating such stress.
However, in the prior art mentioned above, this is not taken into account

Method used

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Examples

Experimental program
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Embodiment Construction

[0038] figure 1 It is a perspective view showing an embodiment of the peeling device of the present invention. In order to unify the directions in the following figures, figure 1 Set the XYZ orthogonal coordinate axis as shown on the bottom right of the. Here, the XY plane represents the horizontal plane, and the Z axis represents the vertical axis. In more detail, the +Z direction indicates the vertical upward direction.

[0039] This peeling device 1 is a device for peeling two plate-shaped bodies carried in with their main surfaces in close contact with each other. For example, it is used in a part of the pattern formation process of forming a predetermined pattern on the surface of a substrate, such as a glass substrate or a semiconductor substrate. More specifically, in this pattern forming process, a pattern forming material is uniformly applied to the surface of a blanket as a carrier for temporarily supporting the pattern to be transferred (application process), and the...

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PUM

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Abstract

The invention relates to a detaching apparatus. A lifting pin (361) projects from the upper surface of a planar horizontal object carrying platform part (31) for receiving a workpiece (WK) that is conveyed from outside. In an abutting area (TR) outside an effective area (AR) in which a substrate (SB) overlaps with rubber cloth (BL) and an effective pattern is formed in a workpiece (WK) that is obtained through close abutting between the substrate (SB) and the rubber cloth (BL), the lifting pin (361) abuts against the lower surface of the rubber cloth (BL). Bending of the workpiece (WK) is suppressed through supporting the overlapped area between the substrate (SB) and the rubber cloth (BL). Additionally, stress concentration on the pattern in the effective area (AR) is prevented.

Description

Technical field [0001] The present invention relates to a peeling device that peels and separates two plate-shaped bodies in close contact with each other. Background technique [0002] As a technique for forming a predetermined pattern or thin film on a plate-shaped body such as a glass substrate or a semiconductor substrate, there is a technique of transferring a pattern or thin film (hereinafter referred to as "pattern" etc.) carried on another plate-shaped body Printed to the substrate. In this technique, after the two plate-shaped bodies are brought into close contact with each other to transfer a pattern or the like from one to the other, it is necessary to peel the two plate-shaped bodies without damaging the pattern. [0003] As a technique that can be used for this purpose, for example, Japanese Patent Application Laid-Open No. 2008-287949 describes an apparatus for peeling off an element formation substrate and a transfer substrate that are in close contact with each oth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F16/00
CPCH01L21/67092H01L21/68742H01L21/78
Inventor 上野美佳川越理史增市干雄上野博之
Owner DAINIPPON SCREEN MTG CO LTD
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