Manufacturing method for intelligent power module

Abstract

The invention provides a manufacturing method for an intelligent power module. The method comprises the steps that: S1) a semi-finished intelligent power module is provided; S2) a lead-wire framework structure is provided; S3) all fixed pins are welded and the fixed pins and electric pins are enabled to be respectively arranged on the two opposite sides of a substrate; S4) the semi-finished intelligent power module is arranged in a mould cavity of a mould, and the tail ends of the fixed pins and the tail ends of the electric pins are clamped by utilizing the mould; S5) a liquid packaging body is injected into the mould cavity of the mould and molded; S6) the mould is opened and the semi-finished intelligent power module after being packaged is taken out; and S7) the tail ends, which are connected together, of the electric pins are cut and the part, which stretches out of the packaging body, of the fixed pins is cut. The substrate is fixed via the electric pins and the fixed pins which are arranged on the two opposite sides so that defective products caused by unbalanced injection molding force can be completely avoided and packaging yield rate can be enhanced. Meanwhile, generation of packaging holes is eliminated, and reliable performance of the intelligent power module is enhanced.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to a manufacturing method of an intelligent power module. Background technique [0002] Intelligent Power Module (IPM for short) is a kind of IGBT ((Insulated Gate Bipolar Transistor)) as a power device, and integrates the power component IGBT and drive circuit, various protection circuits, fault detection circuits, etc. common power drive products. Compared with ordinary IGBT, the system performance and reliability are further improved, and because the IPM dynamic loss and switching loss are relatively low, the size of the radiator is reduced, so the size of the entire system is reduced. [0003] see figure 1 and figure 2 , the prior art discloses an intelligent power module, which includes a metal substrate 101, an insulating layer 102 provided on the metal substrate 101, a circuit wiring 103 formed on the insulating layer 102, and circuit elements fixed...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the embodiments of the present invention is to provide a method for manufacturing an intelligent power module, aiming at solving the problem of the reduction of the yield rate of the intelligent power module in the prior art due to the unbalanced force caused by the pressing pin and the damage caused by the pressing pin during the packaging process. The problem of insufficient packaging density caused by the formed holes

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