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Method for improving interlayer expansion and shrinkage of two-sided copper core-clad substrate and two-sided copper core-clad substrate

A double-sided copper-clad core substrate technology, which is applied in the field of improving the expansion and shrinkage of double-sided copper-clad core substrates and double-sided copper-clad core substrates, can solve the problems of waste, scrapping, and large differences in expansion and contraction between board layers. To achieve the effect of eliminating waste

Active Publication Date: 2014-10-22
JIANGSU BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the prior art, the double-sided copper-clad core substrate (core cap) lamination diagram (taking six layers as an example) is as follows image 3 As shown: the laminated steel plate is in direct contact with the counter-pressed copper foil and the outermost copper-clad core board (core), and the heat of the outer copper-clad core board is greater than that of the middle copper-clad core board. The layered copper-clad core board shrinks much more than the middle copper-clad core board, and the maximum difference can reach 20mil, causing the board to be scrapped due to the large difference in expansion and contraction between layers.
As shown in the figure, the counter-pressed copper foil in contact with the steel plate is mainly to prevent the PP (Polypropylene, polypropylene) glue from flowing into the steel plate during pressing. After the plates are pressed, the copper foil is directly scrapped, and disposal will cause waste

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  • Method for improving interlayer expansion and shrinkage of two-sided copper core-clad substrate and two-sided copper core-clad substrate

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Embodiment Construction

[0018] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0020] Secondly, the present invention is described in detail in combination with schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the gener...

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Abstract

The invention discloses a method for improving interlayer expansion and shrinkage of a two-sided copper core-clad substrate and the two-sided copper core-clad substrate. The method includes: providing a plurality of core layers and the number of the core layers is larger than three; performing circuit manufacture and detection on the core layers; performing browning treatment on surfaces of the core layers; providing a polypropylene layer between every two the plurality of core layers, and providing back pressure copper foils at two ends of the outermost core layer; providing a polypropylene interlayer on a first main surface, and providing an outer layer copper foil on the polypropylene interlayer to obtain a laminated sheet material; and placing the laminated sheet material in a pressing machine for lamination. The method in the invention solves the problem that interlayer expansion and shrinkage difference of the two-sided copper core-clad substrate is too large, i.e. the problem that the expansion and shrinkage difference between the outermost layer of the copper core-clad plate and an intermediate layer of the copper core-clad plate is too large; and solves the problem of waste of back pressure copper foils.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a method for improving interlayer expansion and shrinkage of a double-sided copper-clad core substrate and the double-sided copper-clad core substrate. Background technique [0002] In the prior art, the double-sided copper-clad core substrate (core cap) lamination diagram (taking six layers as an example) is as follows image 3 As shown: the laminated steel plate is in direct contact with the counter-pressed copper foil and the outermost copper-clad core board (core), and the heat of the outer copper-clad core board is greater than that of the middle copper-clad core board. The layered copper-clad core board shrinks much more than the middle copper-clad core board, and the maximum difference can reach 20mil, resulting in the board being scrapped due to the large difference in expansion and contraction between layers. As shown in the picture, the counter-presse...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/38H05K1/02
Inventor 刘艳华黄丽王瑜
Owner JIANGSU BOMIN ELECTRONICS